Semiconductor package
AssigneeUnited Test and Assembly Center Ltd.
InventorsWang Chuen Khiang, Koh Yong Chuan, Fong Kok Chin
Life of this patent
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Abstract
A semiconductor package, containing two or more stacked IC devices attached to a substrate. Each of the IC devices has a plurality of electrical contact regions which are connected to the substrate by means of electrical connections.
Claims14
A semiconductor package comprising:
- a first IC device;
- a second IC device;
- and
- a substrate;
- wherein the first IC device is attached to the substrate and the second IC device is attached to the first IC device;
- the semiconductor package further comprising a first electrical connection between the first IC device and the substrate and a second electrical connection between the second IC device and the substrate.
A semiconductor package according to any preceding claim, further comprising an electrical contact region on the second IC device and said second electrical connection connects the electrical region on the second IC device to the substrate.
A semiconductor package according to any preceding claim, further comprising at least a third IC device, the third IC device attached to the second IC device by means of a spacer;
- and one or more electrical connections, connecting an electrical contact region on each of the IC devices to the substrate.
A semiconductor package according to any preceding claim, further comprising an electrical contact distribution means, attached to an IC device in the semiconductor package;
- wherein an electrical connection is connected to its associated electrical contact region via the electrical contact distribution means.
A semiconductor package according to any preceding claim, wherein the first IC device performs a different function to the second IC device.
Dependencies are inferred from the claim text.