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US 2003/0197281 A1Published application
Integrated circuit package having reduced interconnects
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Jerry M. Brooks
Life of this patent
Estimating the term…
Abstract
A technique for making an integrated circuit package. Specifically, a stacked memory device is provided with minimal interconnects. Memory die are stacked on top of each other and electrically coupled to a substrate. Thru vias are provided in the substrate and/or memory die to facilitate the electrical connects without necessitating a complex interconnect technology between each of the interfaces. Wire bonds are used to complete the circuit package.
Claims40
An integrated circuit package comprising:
- a substrate having first conductive pads thereon;
- a first die having a circuit side and a backside, wherein the backside is adhesively coupled to the substrate, and wherein the circuit side has second conductive pads thereon;
- and
- a second die stacked on the first die, the second die having a circuit side and a backside and having connections therethrough, the connections on the backside of the second die being coupled to respective second conductive pads on the circuit side of the first die and the connections on the circuit side of the second die being coupled to the first conductive pads on the substrate.
1 more element
A system comprising:
- a processor;
- and
- an integrated circuit package coupled to the processor and comprising:
- a substrate having first conductive pads thereon;
- a first die having a circuit side and a backside, wherein the backside is adhesively coupled to the substrate, and wherein the circuit side has second conductive pads thereon;
- and
- a second die stacked on the first die, the second die having a circuit side and a backside and having connections therethrough, the connections on the backside of the second die being coupled to respective second conductive pads on the circuit side of the first die and the connections on the circuit side of the second die being coupled to the first conductive pads on the substrate.
4 more elements
A method of making an integrated circuit package comprising the acts of:
- providing each of a substrate, a first die having a circuit side and a backside, and a second die having a circuit side and a backside and having connections extending therethrough;
- adhesively coupling the backside of the first die to the substrate;
- stacking the second die on the first die such that the backside of the second die is adjacent to the circuit side of the first die;
- coupling the connections on the backside of the second die to second conductive pads on the circuit side of the first die;
- and
- coupling the connections on the circuit side of the second die to first conductive pads on the substrate.
3 more elements
An integrated circuit package comprising:
- a substrate having a front side having first conductive pads thereon and a backside having second conductive pads thereon and having a slot therethrough;
- a first die having a circuit side and a backside, wherein the circuit side has third conductive pads thereon and wherein the circuit side is adhesively coupled to the substrate such that the third conductive pads are aligned with the slot in the substrate and wherein the third conductive pads are coupled to the second conductive pads on the pads on the backside of the substrate;
- and
- a second die having a circuit side and a backside and having fourth conductive pads on the circuit side, wherein the backside of the second die is adhesively coupled to the backside of the first die and wherein the fourth conductive pads on the circuit side of the second die are coupled to the first conductive pads on the frontside of the substrate.
1 more element
A system comprising:
- a processor;
- and
- an integrated circuit package coupled to the processor or and comprising:
- a substrate having a front side having first conductive pads thereon and a backside having second conductive pads thereon and having a slot therethrough;
- a first die having a circuit side and a backside, wherein the circuit side has third conductive pads thereon and wherein the circuit side is adhesively coupled to the substrate such that the third conductive pads are aligned with the slot in the substrate and wherein the third conductive pads are coupled to the second conductive pads on the pads on the backside of the substrate;
- and
- a second die having a circuit side and a backside and having fourth conductive pads on the circuit side, wherein the backside of the second die is adhesively coupled to the backside of the first die and wherein the fourth conductive pads on the circuit side of the second die are coupled to the first conductive pads on the frontside of the substrate.
4 more elements
A method of making an integrated circuit package comprising the acts of:
- providing each of a first die having a circuit side having conductive pads thereon and a backside, a second die having a circuit side and a backside, and a substrate having a frontside and backside and having connections extending therethrough;
- adhesively coupling the circuit side of the first die to the substrate;
- adhesively coupling the backside of the second die to the backside of the first die;
- coupling the connections on the backside of the substrate to the conductive pads on the circuit side of the first die;
- and
- coupling the connections on the frontside of the substrate to the conductive pads on the circuit side of the first die.
3 more elements
Dependencies are inferred from the claim text.