Test fixture for semiconductor packages

A test fixture for semiconductor packages, for electrically connecting a plurality of semiconductor packages to a test device where tests are performed for the semiconductor packages;

• the test fixture comprising:
• a circuit board formed on a surface thereof with a plurality of contact mechanisms and electrically connected to the test device, wherein the contact mechanisms are in electrical contact with input/output connections of the semiconductor packages, so as to allow the semiconductor packages to be mounted on the circuit board and electrically connected to the test device via the circuit board;
• an interposer having an upper surface and a lower surface opposed to the upper surface, the interposer being formed with a plurality of through holes that penetrate through the upper and lower surfaces, wherein the lower surface of the interposer is attached to the circuit board in a manner as to receive the semiconductor packages in the through holes respectively, and each of the through holes is formed on an inner wall thereof with a positioning mechanism that is engaged with a corresponding one of the semiconductor packages received in the through holes, such that the semiconductor packages are held in position within the through holes via the positioning mechanisms, and the input/output connections of the semiconductor packages are assured in electrical contact with the contact mechanisms of the circuit board;
• and
• a covering member mounted on the upper surface of the interposer, for covering the semiconductor packages received in the through holes.