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US 2003/0197261 A1Published application
Memory card
AssigneeSamsung Electronics Co., Ltd.
InventorsMin-Young Son, Se-Yong Oh, Tae-Gyeong Chung
Life of this patent
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Abstract
In one embodiment, a memory card comprises a card substrate, at least one memory chip attached to the card substrate, a control chip mounted on the memory chip, bonding wires electrically connecting the chips with the card substrate, a passive device attached to the card substrate near the memory chip, and a molded body encapsulating the memory chip, the control chip, the bonding wires and the passive device. In addition, the memory card comprises an adhesive spacer interposed between the same-sized chips to secure a wire loop of the bonding wires.
Claims9
A memory card comprising:
- a card substrate;
- at least one memory chip attached to the card substrate;
- a control chip vertically stacked on the memory chip, wherein the chips are electrically connected with the card substrate;
- and
- a molded body encapsulating the memory chip and the control chip.
2 more elements
Dependencies are inferred from the claim text.