Semiconductor device and manufacturing method thereof

A semiconductor device comprising:

• a first semiconductor element having a circuit forming surface and a back surface opposite to the circuit forming surface;
• a first interposer having a surface on which first electrode pads are formed and said first semiconductor element is mounted with the circuit forming surface facing the first interposer;
• a second semiconductor element having a circuit forming surface and a back surface opposite to the circuit forming surface;
• a second interposer having a surface on which second electrode pads are formed and said second semiconductor element is mounted with the circuit forming surface facing the second interposer, the second electrode pads for connection with said first interposer;
• and
• external connection terminals provided on a surface of said second interposer opposite to the surface on which said second semiconductor element is mounted,
• wherein said first interposer and said second interposer are electrically connected to each other by conductive members between said first and second electrode pads, and said first interposer and the back surface of said second semiconductor element are fixed to each other by an adhesive.

A manufacturing method of a semiconductor device comprising a first semiconductor element and a second semiconductor element, comprising the steps of:

• mounting said first semiconductor element onto a first interposer in a state in which a circuit forming surface of said first semiconductor element faces said first interposer;
• mounting said second semiconductor element onto a second interposer in a state in which a circuit forming surface of said second semiconductor element faces said second interposer;
• electrically connecting said first interposer and said second interposer to each other by stacking said first and second interposers with said second semiconductor element interposed therebetween and heating conductive members provided between said first and second interposers so as to melt the conductive members;
• and
• curing a thermosetting adhesive provided between a back surface of said second semiconductor device and one of a back surface of said first semiconductor element and said first interposer by a heat in the step of electrically connecting.