Socket with low inductance side contacts for a microelectronic device package

An electrical contact assembly comprising:

• a plurality of electrically conductive members, each including a first portion and a second portion extending from the first portion, the first portions of the electrically conductive members stacked along a first axis, the second portions distributed along a second axis perpendicular to the first axis;
• and
• a set of dielectric layers including at least one dielectric layer, each dielectric layer sandwiched between the first portions of an adjacent pair of the electrically conductive members.

An apparatus comprising:

• a socket to receive a package of a microelectronic device;
• and
• a contact assembly proximate to the socket, the contact assembly including a pair of electrically conductive members disposed adjacent to each other, at least a first portion of each electrically conductive member positioned to be in contact with a corresponding electrical conductor on an outer surface of the package when the package is coupled to the socket.

An apparatus comprising:

• a socket to receive a package of a microelectronic device;
• and
• an electrical contact assembly coupled to the socket, the contact assembly including a plurality of electrically conductive members disposed adjacent to each other, each of the conductive members including a rigid portion and a flexible portion, the flexible portion of each of conductive member positioned to be in contact with a corresponding electrical conductor on an outer surface of the package when the package is coupled to the socket, the contact assembly further including a dielectric layer sandwiched between each two adjacent rigid portions of the conductive members.