IC package, optical transmitter, and optical receiver

An optical transmitter comprising:

• an IC package including a chip carrier, a bare chip mounted on a first surface of said chip carrier, a plurality of first bumps for connecting a plurality of chip electrodes disposed on said bare chip to a plurality of first conductive pads disposed on the first surface of said chip carrier, respectively, said plurality of first conductive pads being classified into first and second groups, a plurality of vias for connecting a plurality of second conductive pads disposed on a second surface of said chip carrier opposite to the first surface to said first conductive pads of said first group, respectively, a plurality of second bumps connected to said second conductive pads, respectively, and at least a conductive line formed with said chip carrier and connected to one of said first conductive pads of said second group;
• an optical module having a feedthrough in which a conductive line through which a high-frequency signal is transmitted is formed, for transmitting an optical signal;
• and
• a first circuit board to which said IC package is secured by way of said plurality of second bumps of said IC package, a high-frequency signal from said bare chip of said IC package to said optical module being transmitted by way of said conductive line formed with said chip carrier and said conductive line formed in said feedthrough, and signals other than the high-frequency signal being input into said bare chip of said IC package by way of said plurality of second bumps.

An optical receiver comprising:

• an IC package including a chip carrier, a bare chip mounted on a first surface of said chip carrier, a plurality of first bumps for connecting a plurality of chip electrodes disposed on said bare chip to a plurality of first conductive pads disposed on the first surface of said chip carrier, respectively, said plurality of first conductive pads being classified into first and second groups, a plurality of vias for connecting a plurality of second conductive pads disposed on a second surface of said chip carrier opposite to the first surface to said first conductive pads of said first group, respectively, a plurality of second bumps connected to said second conductive pads, respectively, and at least a conductive line formed with said chip carrier and connected to one of said first conductive pads of said second group;
• an optical module having a feedthrough in which a conductive line through which a high-frequency signal is transmitted is formed, for receiving an optical signal;
• and
• a first circuit board to which said IC package is secured by way of said plurality of second bumps of said IC package, a high-frequency signal from said optical module to said bare chip of said IC package being transmitted by way of said conductive line formed in said feedthrough and said conductive line formed with said chip carrier, and signals other than the high-frequency signal output from said bare chip of said IC package being transmitted by way of said first circuit board and said plurality of second bumps.