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US 2003/0197256 A1Published application
Power conditioning substrate stiffener
OwnerRichard Pommerinventor
Life of this patent
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Abstract
Utilization of the “dead space” previously occupied by a metal stiffener in an integrated circuit package as a location for power conditioning and converting mechanisms such as decoupling capacitors and planar transformers.
Claims8
A combination comprising:
- an integrated circuit (IC) comprising a power input pad;
- a power conditioning frame (PCF);
- an interconnect having an IC mounting surface comprising an IC power output pad, a first conditioning pad and a second conditioning pad, the first conditioning pad electrically coupled to the IC power output pad, the second conditioning pad electrically coupled to an interconnect power input pad, the first and second conditioning pads being electrically connected through the power conditioning frame.
A method for assembling an IC package combination comprising:
- providing a known good IC;
- providing a known good interconnect;
- providing a known good PCF;
- coupling the IC to the interconnect;
- coupling the PCF to the interconnect.
2 more elements
A method of assembling a combination:
- providing an integrated circuit (IC) comprising a power input pad;
- providing a power conditioning frame (PCF);
- providing an interconnect having an IC mounting surface comprising a first conditioning pad electrically coupled to an IC power output pad, an interconnect power input pad electrically coupled to a second conditioning pad, the first conditioning pad and second conditioning pad being electrically unconnected;
- electrically coupling the PCF to the first conditioning pad and the second conditioning pad so as to electrically connect the first conditioning pad to the second conditioning pad through the power conditioning frame;
- electrically coupling the IC power input pad to the interconnect power output pad.
2 more elements
Dependencies are inferred from the claim text.