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US 2003/0197255 A1Published application
Semiconductor device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsDai Nakajima, Yoshihiro Kashiba, Hideaki Chuma
Life of this patent
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Abstract
A semiconductor device with a package fixed to a case, comprising: a package where a semiconductor element and a lead terminal connected to the semiconductor element are sealed up; and a case formed by a frame member and an external terminal disposed to the frame member, characterized in that the package is located inside the frame of the case and the lead terminal is connected with the external terminal.
Claims10
A semiconductor device with a package fixed to a case, comprising:
- a package where a semiconductor element and a lead terminal connected to said semiconductor element are sealed up;
- and
- a case formed by a frame member and an external terminal disposed to said frame member,
- characterized in that said package is located inside the frame of said case and said lead terminal is connected with said external terminal.
1 more element
Dependencies are inferred from the claim text.