Package for enclosing a laser diode module
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorNan Tsung Huang
Life of this patent
Estimating the term…
Abstract
A laser diode (LD) module includes a base (20), a four contacts (21), (22), (23) and (24) and package sealing material (25). The base is made of a metal material has three through holes (203), and defines a channel (204) in a bottom side thereof and in communication with the through holes. The four contacts, one is soldered to the base, and the others three inserted through the three through holes. The insulative package sealing material is plastic inserted molded into the channel and connecting through holes to fix the three contacts in the base while preventing electrical connection between the base and the contacts.
Claims20
A package for enclosing a laser diode module suitable for mounting the laser diode module on a printed circuit board (PCB), comprising:
- a base having three through holes and a channel defined in a bottom surface of the base and communicating with the three through holes;
- four contacts for connecting the laser diode module with the PCB, three of the contacts being respectively inserted into the three through holes of the base in such position that they are sited within the through hole without electrically contacting, said through holes and the fourth contact making electrical connection with the base;
- and
- dielectric package sealing material fixing the three contacts in the through holes of the base.
The package as described in claim 10, wherein the interlocking structure is composed of flanges, notches or both.
A package adapted to mount a laser diode module on a printed circuit board (PCB), comprising;
- a base having a plurality of through holes defined therethrough and a channel defined in a surface of the base and communicating with the through holes;
- a plurality of contacts for connection the laser diode module to the print circuit broad, wherein at least one contact makes an electrical connection with the base, and the other contacts are inserted one each into a corresponding through hole with a gap existing between a contact and its corresponding through hole, and a dielectric packaging material fixing the contact inserted into the through holes in place in the base, wherein the packing material is inserted into the channel and flows into the through holes of the base.
A method of making an optic-electro module comprising:
- providing a metallic base with a plurality of through holes therein;
- attaching a housing to the base and defining a space therebetween;
- disposing a printed circuit board in the space with at least one diode thereon;
- providing a plurality of conductive contacts extending through the through holes, respectively, for electrically connecting to the diode;
- and
- filling the through hole with melted sealing material via insert molding to not only electrically segregating the contact from the base in the through hole but also mechanically secure said contact with regard to the base after solidification.
An optic-electro module comprising:
- a metallic base defining a plurality of through holes therein;
- a housing attached on said base and defining a space therebetween;
- a printed circuit board with at least one diode thereon;
- a plurality of conductive contacts extending through the corresponding through holes, respectively, and at least one of said contacts electrically connecting to the diode;
- and
- sealing material filled, via an insert molding process, within the through holes and cooperating with retaining structures around the corresponding through holes for not only sealing but also securement thereof.
Dependencies are inferred from the claim text.