Semiconductor device and method of fabricating the same
AssigneeNEC Compound Semiconductor Devices, Ltd.
InventorsTaibo Nakazawa, Koki Hirasawa
Life of this patent
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Abstract
An electronic device includes (a) a first wiring substrate including a metal area and formed with a recess reaching the metal area, and (b) a second wiring substrate including a ground electrode formed in an area other than a signal transmission path at the recess and around the recess when coupled to the first wiring substrate, and further including at least one first electronic part mounted thereon. The first and second wiring substrates are coupled directly to each other such that the first electronic part is located in the recess.
Claims28
An electronic device including:
- (a) a first wiring substrate including a metal area and formed with a recess reaching said metal area;
- and
- (b) a second wiring substrate including a ground electrode formed in an area other than a signal transmission path at said recess and around said recess when coupled to said first wiring substrate, and further including at least one first electronic part mounted thereon,
- wherein said first and second wiring substrates are coupled directly to each other such that said first electronic part is located in said recess.
An electronic device including:
- (a) a first wiring substrate including a metal area and formed with a plurality of recesses each reaching said metal area;
- and
- (b) a second wiring substrate comprised of at least one sub-substrate including a ground electrode formed in an area other than a signal transmission path at said recess and around said recess when coupled to said first wiring substrate, and further including at least one first electronic part mounted thereon,
- wherein said first and second wiring substrates are coupled directly to each other such that said first electronic part is located in one of said recesses associated therewith.
A method of fabricating an electronic device, comprising the steps of:
- (a) forming a recess at a surface of a first wiring substrate including a metal area such that said recess reaches said metal area;
- (b) mounting a first electronic part on a surface of a second wiring substrate including a ground electrode formed in an area other than a signal transmission path at said recess and around said recess when coupled to said first wiring substrate;
- and
- (c) coupling said first and second wiring substrates directly to each other such that said first electronic part is located in said recess.
A method of fabricating an electronic device, comprising the steps of:
- (a) forming a plurality of recesses at a surface of a first wiring substrate including a metal area such that each of said recesses reaches said metal area;
- (b) mounting a first electronic part on a surface of a second wiring substrate comprised of at least one sub-substrate including a ground electrode formed in an area other than a signal transmission path at said recess and around said recess when coupled to said first wiring substrate;
- and
- (c) coupling said first and second wiring substrates directly to each other such that said first electronic part is located in one of said recesses associated therewith.
Dependencies are inferred from the claim text.