Contactable integrated circuit and method of producing such a circuit
OwnerThomas Dodererinventor
Life of this patent
Estimating the term…
Abstract
In an integrated circuit on a substrate material with a terminal area for contacting the integrated circuit, the integrated circuit includes a contact area for the connection of the integrated circuit to external lines. A stripline for transmitting high-frequency signals is provided between the contact area and the terminal area.
Claims20
A circuit assembly, comprising:
- a substrate material;
- an integrated circuit disposed on said substrate material and formed as a wafer level package;
- a terminal area contacting at least a portion of said integrated circuit;
- a contact area disposed on said integrated circuit for connecting said integrated circuit to external lines;
- and
- an integrated stripline for transmitting high-frequency signals, said stripline being provided in an integrated form between said contact area and said terminal area.
In a circuit assembly having a substrate material and an integrated circuit formed as a wafer level package on the substrate material, a connection configuration comprising:
- a terminal area contacting the integrated circuit;
- a contact area disposed on the integrated circuit for connecting the integrated circuit to external lines;
- and
- an integrated stripline for transmitting high-frequency signals, said stripline being provided in an integrated form between said contact area and said terminal area.
An integrated circuit formed as a wafer level package on a substrate material, comprising:
- a terminal area for contacting the integrated circuit;
- a contact area for connecting the integrated circuit to external lines, said contact area being disposed on the integrated circuit;
- and
- an integrated stripline for transmitting high-frequency signals, said stripline being provided in an integrated form between said contact area and said terminal area.
A method of producing a contactable integrated circuit, which comprises:
- providing an integrated circuit with a terminal area;
- applying a non-electrical layer to the integrated circuit;
- applying a contact area at the integrated circuit;
- applying a conductor connection connecting the terminal area to the contact area;
- and
- disposing a conductor structure at the integrated circuit isolated from the conductor connection to form with the conductor connection a stripline.
A method of producing a contactable integrated circuit having a terminal area, which comprises:
- applying a non-electrical layer;
- applying a contact area;
- applying a conductor connection in order to connect the terminal to the contact area;
- and
- disposing a conductor structure isolated from the conductor connection to form with the conductor connection a stripline.
Dependencies are inferred from the claim text.