Multilayer intergrated circuit structure with reduced magnetic coupling
AssigneeMotorola, Inc.
InventorJohn C. Estes
Life of this patent
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Abstract
A method of utilizing passive circuit components in an integrated circuit comprising the steps of providing a plurality of integrated capacitive elements and a plurality of integrated inductive elements interconnected to form an electrical circuit wherein each inductive element has a width and creates a circumferential magnetic field. Each integrated inductive element is oriented such that the circumferential magnetic field is parallel to the plane of each adjacent integrated capacitive element and parallel to the width of the integrated inductive element so that the resistance of the electrical circuit is decreased and the quality factor is increased.
Claims14
A microstrip integrated circuit apparatus comprising:
- an integrated capacitive element, each integrated capacitive element defining a surface;
- an integrated inductive element with a width and a volume interconnected with the integrated capacitive element to form an integrated circuit section, wherein the integrated inductive element has a resistance and an inductance and wherein the integrated inductive element induces a circumferential magnetic field and wherein the integrated inductive element is oriented such that the circumferential magnetic field is parallel to the width and parallel to the plane of at least one integrated capacitive element.
A microstrip resonant circuit apparatus comprising:
- a dielectric substrate;
- a multilayer capacitive element positioned on or within the dielectric substrate, wherein the multilayer capacitive element defines a surface;
- and
- a multilayer inductive element with a width and a volume positioned adjacent or within the dielectric substrate wherein multilayer inductive element has an inductance and a resistance, and wherein the multilayer inductive element induces a circumferential magnetic field and is interconnected with the multilayer capacitive element to form a resonant circuit and wherein the multilayer inductive element is oriented such that the circumferential magnetic field is parallel to the width and to the plane of at least one multilayer capacitive element.
A method of adjusting the quality factor of a microstrip resonant circuit comprising the steps of:
- providing a dielectric substrate;
- forming a resonant circuit with a quality factor including at least one inductive element with a width and at least one capacitive element which defines a surface wherein the resonant circuit is positioned on or within the dielectric substrate and wherein each inductive element creates a circumferential magnetic field;
- and
- orienting the inductive element such that the circumferential magnetic field is parallel to the width and to the surface of the capacitive element.
Dependencies are inferred from the claim text.