Semiconductor device and semiconductor module
AssigneeSanyo Electric Co., Ltd.
InventorsNoriaki Sakamoto, Yoshiyuki Kobayashi, Junji Sakamoto, Shigeaki Mashimo, Katsumi Okawa, Eiju Maehara, Kouji Takahashi
Life of this patent
Estimating the term…
Abstract
A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed through the insulating resin 44 and sealed. With this arrangement, fractures of the conductive paths 40 embedded in the insulating resin 44 are suppressed.
Claims35
A semiconductor device comprising:
- a semiconductor chip;
- a passive element;
- a first pad electrically connected to the semiconductor chip;
- a second pad electrically connected to the passive element;
- a land on which the semiconductor chip is mounted;
- a wiring line integrally extended from the land and having a width smaller than a width of the semiconductor chip to make the semiconductor device constitute a circuit or a system;
- and
- an insulating resin for sealing the semiconductor chip, the passive element, the first pad, the second pad and the land.
A semiconductor device comprising:
- a semiconductor chip;
- a passive element;
- a first pad electrically connected to the semiconductor chip;
- a second pad electrically connected to the passive element;
- a land on which the semiconductor chip is mounted;
- a wiring line integrally extended from the land and having a width smaller than the semiconductor chip to make the semiconductor device constitute a hybrid-type circuit or a hybrid-type system;
- and
- an insulating resin covering the semiconductor chip, the passive element, the first pad, the second pad and the land.
A semiconductor device comprising:
- a plurality of conductive paths, said conductive paths comprising crystals oriented more transversally than vertically, relative to a plane of the conductive paths;
- a semiconductor chip disposed over the conductive paths and coupled electrically to at least one of the conductive paths;
- an insulating resin disposed on the semiconductor chip and disposed to separate the conductive paths having the film disposed thereon.
A semiconductor device comprising:
- a plurality of conductive paths;
- a film disposed on and coupled electrically to each of the conductive paths;
- a semiconductor chip disposed over the film and coupled electrically to at least one of the conductive paths through the film;
- an insulating resin disposed on the semiconductor chip and disposed to separate the conductive paths having the film disposed thereon,
- wherein said film is spaced away from edges of the conductive paths.
A semiconductor device comprising:
- a plurality of conductive paths;
- a semiconductor chip disposed over the conductive paths and coupled electrically to at least one of the conductive paths;
- an insulating resin disposed on the semiconductor chip and disposed to separate the conductive paths having the film disposed thereon,
- wherein said insulating resin extends beyond the conductive paths at a side of the semiconductor device opposite a side where the semiconductor chip is disposed.
A semiconductor device comprising:
- a plurality of conductive paths;
- a film disposed on and coupled electrically to each of the conductive paths;
- a semiconductor chip disposed over the film and coupled electrically to at least one of the conductive paths through the film;
- an insulating resin disposed on the semiconductor chip and disposed to separate the conductive paths having the film disposed thereon,
- wherein said conductive paths comprise crystals oriented substantially greater in a first direction substantially parallel to the film than in a second direction substantially perpendicular to the film.
Dependencies are inferred from the claim text.