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AssigneeMolex Incorporated
InventorsAugusto P. Panella, Arindum Dutta, James L. McGrath
Estimating the term…
A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The power reservoir is integrated into a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least one opening that opens up to a operational surface of the integrated circuit. A heat-dissapating device, such as a finned heat sink or the like is supported by the cover member and extends through its opening into contact with a heat-generating surface of the integrated circuit to cool it during operation.
A power delivery and thermal management assembly for supplying power to an integrated circuit and dissipating heat away from the integrated circuit during operation thereof, the integrated circuit having conductive traces disposed thereon, the assembly comprising, in combination:
The assembly of claim 5, wherein said first capacitor plate includes a plurality of first terminals and said second capacitor plate includes a plurality of second terminals, said first and second terminals being disposed adjacent each other along edges of said first and second plates.
A power transfer and heat management assembly for conveying power from a power supply to an integrated circuit (“IC”), the IC incorporating a plurality of power and non-power circuits in a body portion thereof, the IC body portion including a plurality of conductive portions disposed thereon leading to said power and non-power circuits, the assembly comprising, in combination:
A power decoupling assembly for providing an integrated circuit (“IC”) with power and for conveying heat generated by the IC during operation, said IC having a defined shape with opposing top and bottom surfaces which are interconnected by at least one side surface, the bottom surface thereof including a plurality of conductive portions for contacting conductive terminals of a mounting connector that serves to connect said IC to a circuit board, the decoupling assembly comprising:
Dependencies are inferred from the claim text.