US 2003/0197195 A1Published application

Heat spreader interconnect methodology for thermally enhanced PBGA packages

AssigneeSt Assembly Test Services Pte Ltd

InventorsIl Kwon Shim, Hermes T. Apale, Gerry Balanon

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Abstract

A new method is provided for the interface between a heat spreader and the substrate of a thermally improved PBGA package. The heat spreader interfaces with the substrate with the standoff of the heat spreader. The stand-off of the heat spreader is provided with an opening, the stand-off of the heat spreader is aligned with the substrate of the PBGA package by means of a copper pad that is provided over a second surface of the substrate. A gold stud bump or a solder bump are further provided over the surface of the copper pad for alignment purposes. Thermally conductive epoxy or solder is deposited over the opening of the heat spreader and therewith over the copper pad provided over a second surface of the substrate. Under an additional embodiment of the invention, extremities if the heat spreader stand-off are aligned with contact pads provided over the second surface of the substrate of the package, thermally conductive epoxy is deposited over the contact surfaces between the extremities and the contact pads.

Claims48

Dependent claims

A thermally enhanced Plastic Ball Grid Array (PBGA) package comprising a heat sink for mounting over a surface of a substrate of the thermally enhanced Plastic Ball Grid Array (PBGA) package, said heat sink comprising:

(a) a horizontal section being parallel with a substrate over which said heat spreader is being mounted, said horizontal section having a perimeter;
(b) heat spreader stand-off sections extending from said perimeter of said horizontal section, a lower section of said heat spreader stand-off sections forming a physical interface between said heat spreader and said substrate over which said heat spreader is being mounted;
(c) each of said heat spreader standoff sections comprising:
(i) an upper section being connected with said horizontal section of said heat spreader under an angle
(ii) a center section being connected with said upper section in a plane of said upper section, and
(iii) said lower section being connected with said center section of said heat spreader standoff section;
(d) each lower section of each of said heat spreader standoff sections comprising:
(i) a first horizontal section being parallel with the surface of said substrate, said first horizontal section being connected with said lower section of said heat spreader stand-off section;
(ii) a U-shaped extrusion connected with said first horizontal section, with a lower side of said U-shaped extrusion facing said substrate, with two retaining sides of said U-shaped extrusion interfacing with the surface of said substrate under an angle, with at least one opening having been created through said lower side of said U-shaped extrusion;
and
(iii) a second horizontal section connected to said U-shaped extrusion.

8 more elements

A method for packaging a semiconductor device, forming a Plastic Ball Grid Array (PBGA) package, comprising the steps of:

(A) providing a semiconductor device mounting support having a first and a second surface, said semiconductor device mounting support having been provided with interconnect traces and at least one metal pad therein or thereover;
(B) mounting at least one semiconductor device over the second surface of said semiconductor device mounting support;
(C) connecting said at least one semiconductor device in a face upward position by facing an active surface of said at least one semiconductor device away from said semiconductor device mounting support, using interconnect wires between said interconnect traces provided in said semiconductor device mounting support and contact points provided in an active surface of said at least one semiconductor device;
(D) positioning a heat spreader over the surface of said substrate, said heat spreader comprising:
(a) a horizontal section being parallel with a semiconductor device mounting support over which said heat spreader is being mounted, said horizontal section having a
(b) heat spreader standoff sections extending from said perimeter of said horizontal section, a lower section of said heat spreader stand-off sections forming a physical interface between said heat spreader and said semiconductor device mounting support over which said heat spreader is being mounted;
(c) each of said heat spreader standoff sections comprising:
(i) an upper section being connected to said horizontal section of said heat spreader under an angle
(ii) a center section being connected with said upper section in a plane of said upper section, and
(iii) said lower section being connected with said center section of said heat spreader standoff section;
(d) each lower section of each of said heat spreader standoff sections comprising:
(i) a first horizontal section being parallel with the surface of said semiconductor device mounting support, said first horizontal section being connected with said lower section of said heat spreader stand-off section;
(ii) a U-shaped extrusion connected with said first horizontal section, with a lower side of said U-shaped extrusion facing said semiconductor device mounting support, with two remaining sides of said U-shaped extrusion interfacing with the surface of said semiconductor device mounting support under an angle, with at least one opening having been created through said lower side of said U-shaped extrusion;
and
(iii) a second horizontal section connected to said U-shaped extrusion;
and
(E) having mounted and interconnected at least one semiconductor device, further creating a mold compound overlying at least part of said heat spreader.

14 more elements

A method for packaging a semiconductor device, forming a Plastic Ball Grid Array (PBGA) package, comprising the steps of:

(A) providing a semiconductor device mounting support having a first and a second surface, said semiconductor device mounting support having been provided with interconnect traces and at least one metal pad therein or thereover, a stud bump having been provided over the surface of said at least one metal pad;
(B) mounting at least one semiconductor device over the second surface of said semiconductor device mounting support;
(C) connecting said at least one semiconductor device in a face upward position by facing an active surface of said at least one semiconductor device away from said semiconductor device mounting support, using interconnect wires between said interconnect traces provided in said semiconductor device mounting support and contact points provided in an active surface of said at least one semiconductor device;
(D) positioning a heat spreader over the surface of said semiconductor mounting support, said heat spreader comprising:
(a) a horizontal section being parallel with a semiconductor device mounting support over which said heat spreader is being mounted, said horizontal section having a
(b) heat spreader stand-off sections extending from said perimeter of said horizontal section, a lower section of said heat spreader stand-off sections forming a physical interface between said heat spreader and said semiconductor device mounting support over which said heat spreader is being mounted;
(c) each of said heat spreader standoff sections comprising:
(i) an upper section being connected to said horizontal section of said heat spreader under an angle
(ii) a center section being connected with said upper section in a plane of said upper section, and
(iii) said lower section being connected with said center section of said heat spreader standoff section;
(d) each lower section of each of said heat spreader standoff sections comprising:
(i) a first horizontal section being parallel with the surface of said semiconductor device mounting support, said first horizontal section being connected with said lower section of said heat spreader stand-off section;
(ii) a U-shaped extrusion connected with said first horizontal section, with a lower side of said U-shaped extrusion facing said semiconductor device mounting support, with two remaining sides of said U-shaped extrusion interfacing with the surface of said semiconductor device mounting support under an angle, with at least one opening having been created through said lower side of said U-shaped extrusion;
and
(iii) a second horizontal section connected to said U-shaped extrusion;
and
(E) mounting and interconnecting at least one semiconductor device, further creating mold compound overlying at least part of said heat spreader.

14 more elements

A method for packaging a semiconductor device, forming a Plastic Ball Grid Array (PBGA) package, comprising the steps of:

(A) providing a semiconductor device mounting support having a first and a second surface, said semiconductor device mounting support having been provided with interconnect traces and at least one metal pad therein or thereover, a solder bump having been provided over the surface of said at least one metal
(B) mounting at least one semiconductor device over the second surface of said semiconductor device mounting support;
(C) connecting said at least one semiconductor device in a face upward position by facing an active surface of said at least one semiconductor device away from said semiconductor device mounting support, using interconnect wires between said interconnect traces provided in said semiconductor device mounting support and contact points provided in an active surface of said at least one semiconductor device;
(D) positioning a heat spreader over the surface of said semiconductor mounting support, said heat spreader comprising:
(a) a horizontal section being parallel with a semiconductor device mounting support over which said heat spreader is being mounted, said horizontal section having a perimeter;
(b) heat spreader stand-off sections extending from said perimeter of said horizontal section, a lower section of said heat spreader stand-off sections forming a physical interface between said heat spreader and said semiconductor device mounting support over which said heat spreader is being mounted;
(c) each of said heat spreader standoff sections comprising:
(i) an upper section being connected to said horizontal section of said heat spreader under an angle
(ii) a center section being connected with said upper section in a plane of said upper section, and
(iii) said lower section being connected with said center section of said heat spreader standoff section;
(d) each lower section of each of said heat spreader standoff sections comprising:
(i) a first horizontal section being parallel with the surface of said semiconductor device mounting support, said first horizontal section being connected with said lower section of said heat spreader stand-off section;
(ii) a U-shaped extrusion connected with said first horizontal section, with a lower side of said U-shaped extrusion facing said semiconductor device mounting support, with two remaining sides of said U-shaped extrusion interfacing with the surface of said semiconductor device mounting support under an angle, with at least one opening having been created through said lower side of said U-shaped extrusion;
and
(iii) a second horizontal section connected to said U-shaped extrusion;
and
(E) mounting and interconnecting at least one semiconductor device, further creating mold compound overlying at least part of said heat spreader.

14 more elements

A method for packaging a semiconductor device, forming a Plastic Ball Grid Array (PBGA) package, comprising the steps of:

(A) providing a semiconductor device mounting support having a first and a second surface, said semiconductor device mounting support having been provided with interconnect traces and at least one metal pad therein or thereover, a solder bump having been provided over the surface of said at least one metal pad;
(B) mounting at least one semiconductor device over the second surface of said semiconductor device mounting support;
(C) connecting said at least one semiconductor device in a face upward position by facing an active surface of said at least one semiconductor device away from said semiconductor device mounting support, using interconnect wires between said interconnect traces provided in said semiconductor device mounting support and contact points provided in an active surface of said at least one semiconductor device;
(D) positioning a heat spreader over the surface of said semiconductor device mounting support, said heat spreader comprising:
(a) a horizontal section being parallel with a semiconductor device mounting support over which said heat spreader is being mounted, said horizontal section having extremities around a perimeter thereof;
(b) heat spreader stand-off sections extending from said perimeter of said horizontal section, a second horizontal section of a lower section of said heat spreader stand-off sections forming a physical interface between said heat spreader and said semiconductor device mounting support;
(c) each of said heat spreader standoff sections comprising:
(i) an upper section being connected to said horizontal section of said heat spreader under an angle;
(ii) a first center section being connected with said upper section of said heat spreader standoff section in a plane of said upper section;
(iii) a lower section being connected with said first center section of said heat spreader stand-off section, said lower section comprising:
(1) a first horizontal section connected with said lower section, said first horizontal section being parallel with the surface of said semiconductor device mounting support;
(2) a second center section intersecting connected with said first horizontal section, said second center section intersecting the surface of said semiconductor device mounting support under an angle;
(3) said second horizontal section connected to said second center section;
and
(4) an essentially spherically shaped supportive metal interface between said first horizontal section of said lower section of said heat spreader stand-off section and the surface of said semiconductor device mounting support as a physical extension of said first horizontal section;
and
(E) mounting and interconnecting at least one semiconductor device, further creating mold compound overlying at least part of said heat spreader.

14 more elements

Dependencies are inferred from the claim text.