Ultra fine patterning process for multi-layer substrate
OwnerMoriss Kung, Kwun-Yao Hoinventors
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Abstract
The present invention discloses an ultra fine patterning process for multi-layer substrate by using selective deposition resist which inhibits metal nucleation during metal deposition process. The present invention can be executed by a fine pattern stamp adsorbing the self-assembled monolayers (SAM), then proceeds the stamping process on a surface of a substrate to achieve the selective deposited SAM with ultra fine pattern. Then, the metal deposition process will be proceeded to make metal deposited selectively on the portion not covered by the SAM to form the patterned metal layer directly.
Claims14
An ultra fine patterning process for multi-layer substrate, which comprising at least the following steps:
- (a) providing a substrate which is completed from the pre-process;
- (b) providing a stamp, the surface of the stamp has been patterned and is attached a film characterized by metal nucleation inhibition;
- (c) printing the stamp on at least a surface of the substrate to make the film attach on the substrate;
- (d) depositing a metal layer on the surface of the substrate printed with the stamp to form a patterned metal layer directly;
- and
- (e) removing the film from the surface of the substrate.
A ultra fine patterning process for multi-layer substrate, which comprising at least the following steps:
- (a) providing a substrate which is completed from the pre-process, wherein at least one surface of the substrate is with a patterned dielectric layer;
- (b) providing a stamp, the surface of the stamp is attached a film characterized by metal nucleation inhibition;
- (c) printing the stamp on the patterned dielectric layer to make the film on the surface of the stamp attach on the patterned dielectric layer of the substrate;
- (d) depositing a metal layer on the surface of the substrate to form a patterned metal layer directly;
- and
- (e) removing the film from the surface of the substrate.
Dependencies are inferred from the claim text.