Heat seal blister package having improved moisture vapor transmission barrier and method for forming same

#1. Field of the Invention

#The present invention relates in general to a heat seal blister package for housing a product and, more particularly, to a heat seal blister package having improved moisture vapor transmission properties to house a product which is moisture sensitive.

#2. Background Art

#FIG. 1 is a front elevational view of a blister package according to the present invention;

#FIG. 2 is a left side elevational view of the blister package shown in FIG. 1;

#FIG. 3 is a perspective view of the blister package shown in FIG. 1;

#While this invention is susceptible of embodiment in many different forms, there are shown in the drawings, and will be described in detail, several specific embodiments with the understanding that the present disclosure is to be considered as an exemplification of the principals of the invention and is not intended to limit the invention to the embodiments illustrated.

#Blister package 20 is shown in FIGS. 1-3 as comprising substantially paperboard card 22 and plastic blister 24. At the outset, it must be noted that while card 22 is shown as having a substantially square configuration, card 22 may take any desired configuration which may be used in conjunction with a given blister, which also may take any desired configuration. Further, while card 22 is shown in the drawings as a single, two-sided piece of paperboard, the card may comprise any substantially paperboard substrate taking any number of shapes, dimensions or sizes. Indeed, the substantially paperboard substrate may comprise an envelope, a box, or any other object which contains a substantially paperboard surface. Moreover, while card 22 will be described as having a substantially paperboard composition, it is likewise contemplated that card may include other materials or sections, as long as at least a portion of the card is fabricated from paperboard. Throughout this description and the drawings, like parts will be designated by like reference numerals.

#Card 22 includes blister side 30, back side 32 and coating 34. Once again, those with ordinary skill in the art with the present disclosure before them will appreciate that card 22 is one of many possible substrates; however, the present invention will be described relative to the card shown. Coating 34 covers at least a portion of one side of card 22, and is shown as preferably covering the entirety of blister side 30. Complete coverage of the blister side of card 22 ensures that plastic blister 24 may be sealed to any portion of the card, in any desired orientation, without specifically aligning the plastic blister with a particular coated area. Further, complete coverage likewise ensures that the entirety of the blister pocket, described below, will be adjacent to and protected from infiltration of moisture vapor which penetrates through unprotected areas of card 22.