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US 2003/0196906 A1Published application
Nickel electroplating solution
AssigneeShipley Company, L.L.C.
InventorsMakoto Kondo, Haruki Enomoto, Motoya Shimazu
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Abstract
Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 4 to 9, and a ratio of nickel ions to chloride ions of 1 or less.
Claims5
A nickel electroplating solution, comprising:
- a) nickel ions, and
- b) at least two chelating agents selected from the group consisting of amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids,
- wherein the nickel electroplating solution has a pH of 4 to 9, and a ratio of nickel ions to chloride ions of 1 or less.
Dependencies are inferred from the claim text.