System and method for electrolytic plating

An electrolytic plating system for plating vias and thru-holes in printed circuit boards, comprising:

• an electrolyte bath;
• a lower rod above said bath;
• a flexible electrical current supply connection attached to said lower rod;
• at least one printed circuit board clamp attached to said lower rod;
• a floating shield with v-saddles in contact with said printed circuit boards, said floating shield further comprising a venturi-shaped partition;
• at least one eductor in a lower portion of said bath below said floating shield for producing a laminar flow of electrolyte across said printed circuit boards;
• and
• means to alternate said laminar flow from one side of said printed circuit board to an other side of said printed circuit board.

An electrolytic plating system for printed circuit boards comprising:

• a plating line supporting said printed circuit boards with a lower support rod;
• an upper rod that supports said lower rod;
• a vibrator on said upper rod;
• and
• a spring system to mount said upper rod to a rigid structure.

An electrolytic plating method for plating vias and thru-holes in printed circuit boards, comprising:

• providing an electrolyte bath;
• positioning a lower rod above said bath;
• providing electrical current to said lower rod with a flexible connection;
• clamping at least one printed circuit board to said lower rod;
• transporting said printed circuit boards in a floating shield with v-saddles in contact with said printed circuit boards, said floating shield further positioning a venturi-shaped partition below said printed circuit boards;
• producing a laminar flow of electrolyte across said printed circuit boards with at least one eductor positioned in a lower portion of said bath below said floating shield;
• and
• alternating said laminar flow from one side of said printed circuit board to an other side of said printed circuit board.

An electrolytic plating method for printed circuit boards comprising:

• supporting said printed circuit boards with a lower support rod of a plating line;
• supporting said lower rod with an upper rod;
• supplying vibration energy to said upper rod;
• and
• mounting said upper rod to a rigid structure with a spring system.