Method for plating metal onto wafers

A method for chemical plating, comprising:

• opening a first valve to evacuate an enclosure having a substrate disposed therein,
• pulling vacuum on the enclosure;
• closing the first valve and opening a second valve to fill the enclosure with an electrolyte solution;
• closing the second valve;
• chemical plating a metal layer on at least a portion of a surface of the substrate;
• opening the second valve to drain the electrolyte solution from the enclosure;
• and
• closing the second valve and opening a fourth valve to vent the enclosure prior to removing the plated substrate from the enclosure.

A method for chemical plating, comprising:

• evacuating an enclosure having a substrate disposed therein under a vacuum sufficient to substantially purge gases from the enclosure;
• filling the enclosure with a pressurized electrolyte solution;
• energizing one or more ultrasonic sources disposed within the enclosure to agitate the electrolyte solution;
• chemical plating a metal layer on a surface of the substrate;
• and
• draining the electrolyte solution from the enclosure.

A method for chemical plating, comprising:

• evacuating an enclosure having a substrate disposed therein under vacuum;
• filling the enclosure with an electrolyte solution having a pressure sufficient to substantially collapse air bubbles in the electrolyte solution;
• and
• chemical plating a metal layer on at least a portion of a surface of the substrate.

A method for chemical plating, comprising:

• evacuating an enclosure having a substrate disposed therein under vacuum;
• filling the enclosure with an electrolyte solution having a pressure sufficient to substantially collapse air bubbles in the electrolyte solution;
• varying the pressure of the electrolyte solution to agitate the electrolyte solution;
• and
• chemical plating a metal layer on a surface of the substrate.

A method for chemical plating, comprising:

• exposing a substrate surface to a vacuum that is sufficient to substantially remove gases from the substrate surface;
• exposing the substrate surface to an electrolyte solution;
• energizing one or more ultrasonic sources to agitate the electrolyte solution;
• chemical plating a metal layer on at least a portion of the substrate surface at a variable pressure between about 1 atm and about 100 atm;
• and
• draining the electrolyte solution from the enclosure.

A method for chemical plating, comprising:

• exposing a substrate surface to a vacuum that is sufficient to substantially remove gases from the substrate surface;
• exposing the substrate surface to an electrolyte solution;
• pressurizing the electrolyte solution;
• and
• chemical plating a metal layer on at least a portion of the substrate surface.

A method for chemical plating, comprising:

• exposing a substrate surface to a vacuum that is sufficient to substantially remove gases from the substrate surface;
• exposing the substrate surface to an electrolyte solution;
• energizing one or more ultrasonic sources to agitate the electrolyte solution;
• and
• chemical plating a metal layer on at least a portion of the substrate surface.