US 2003/0196833 A1 · Multilayer printed circuit board and method of manufacturing multilayer printed circuit board

Abstract

A multilayer printed circuit board which can surely establish interlayer connection with low resistance. The multilayer printed circuit board comprises: a first substrate having a conductive pattern on one face and a non-penetration connection hole on the other face, for exposing the conductive pattern to outside; a second substrate having a conductive pattern formed on a face opposed to the other face of first substrate and a conductive bump on the conductive pattern integrally. The first substrate and the second substrate are integrated by engaging the bump of the second substrate with the connection hole of the first substrate and by intervening a conductive cement between the bumps and the conductive pattern exposed to outside from the connection holes.

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Claims17

Dependent claims

A multilayer printed circuit board comprising:

a first substrate having a conductive pattern formed on a first face thereof and a non-penetrated connection hole formed on a second face for exposing said conductive pattern to outside;
a second substrate having a conductive pattern formed on a first face thereof opposed to the second face of said first substrate, and a conductive bump formed integrally on the conductive pattern;
and
an insulting layer formed between said first substrate and said second substrate, wherein, said first substrate and said second substrate are integrated by engaging said bump of said second substrate with said connection hole of said first substrate, and by intervening a conductive cement between said bump and said conductive pattern which is exposed to outside from said connection hole.

1 more element

Dependencies are inferred from the claim text.

Multilayer printed circuit board and method of manufacturing multilayer printed circuit board

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