Reconfigurable multilayer printed circuit board
AssigneeHewlett-Packard Development Company, L.P.
InventorMelvin Peterson
Life of this patent
Estimating the term…
Abstract
The present invention is a reconfigurable substrate which includes at least one signal line layer stack. Each signal line layer stack is defined to include two substantially parallel insulating layers and a signal line layer interposed between the two insulating layers and substantially parallel to the insulating layers. The substrate includes at least one conductive isolation layer adjacent to at least one signal line layer stack and substantially parallel to the at least one signal line layer stack. The substrate is reconfigurable to different performance levels by adding or removing at least one conductive isolation layer.
Claims32
A reconfigurable substrate, comprising:
- at least one signal line layer stack, each signal line layer stack defined to include:
- two substantially parallel insulating layers;
- and
- a signal line layer interposed between the two insulating layers and substantially parallel to the insulating layers;
- and
- at least one conductive isolation layer adjacent to the at least one signal line layer stack and substantially parallel to the at least one signal line layer stack, wherein the substrate is reconfigurable to different performance levels by adding or removing one or more of the at least one conductive isolation layers.
A printed circuit board, comprising:
- at least one first conductive isolation layer;
- at least one signal line layer group, each signal line layer group defined to include:
- at least one signal line layer stack, each signal line layer stack defined to include:
- at least one signal line layer;
- and
- two substantially parallel second insulating layers located on both a first side and a second side of the at least one signal line layer;
- and
- at least one second conductive isolation layer adjacent to the at least one signal line layer stack and substantially parallel to the at least one signal line layer stack;
- and
- at least one first insulating layer interposed between the at least one signal line layer group and the at least one first conductive isolation layer and substantially parallel to the at least one signal line layer group, wherein the substrate is reconfigurable to different performance levels by adding or removing one or more of the at least one first conductive isolation layers or one or more of the at least one second conductive isolation layers.
A reconfigurable substrate, comprising:
- at least one signal line layer stack, each signal line layer stack defined to include:
- two substantially parallel insulating layers;
- and
- a signal line layer interposed between the two insulating layers and substantially parallel to the insulating layers;
- at least one conductive isolation layer adjacent to at least one signal line layer stack and substantially parallel to the at least one signal line layer stack;
- and
- means to permit reconfiguring of the substrate to different performance levels.
A method of reconfiguring a substrate, the method comprising:
- providing two substantially parallel insulating layers;
- providing a signal line layer interposed between the two insulating layers and substantially parallel to the insulating layers;
- providing at least one conductive isolation layer adjacent to at least one signal line layer stack and substantially parallel to the at least one signal line layer stack;
- and
- reconfiguring the substrate to different performance levels by adding or removing one or more of the at least one conductive isolation layers.
A method of reconfiguring a printed circuit board, the method comprising:
- providing at least one first conductive isolation layer;
- providing at least one signal line layer group, each signal line layer group defined to include:
- at least one signal line layer stack, each signal line layer stack defined to include:
- at least one signal line layer;
- and
- two substantially parallel second insulating layers located on both a first side and a second side of the at least one signal line layer;
- and
- at least one second conductive isolation layer adjacent to the at least one signal line layer stack and substantially parallel to the at least one signal line layer stack;
- and
- providing at least one first insulating layer interposed between the at least one signal line layer group and the at least one first conductive isolation layer and substantially parallel to the at least one signal line layer group;
- and
- reconfiguring the printed circuit board to different performance levels by adding or removing one or more of the at least one first conductive isolation layers or one or more of the at least one second conductive isolation layers.
Dependencies are inferred from the claim text.