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US 2003/0196831 A1Published application
Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board
AssigneeNEC Corporation
InventorYuki Momokawa
Life of this patent
Estimating the term…
Abstract
An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.
Claims77
A wiring board including:
- a substrate having at least one through hole;
- at least one land extending on at least one surface of said substrate, and said at least one land extending adjacent to an opening of said at least one through hole;
- and
- at least one coating layer which coats at least one part of an outer peripheral region of said at least one land.
1 more element
A wiring board including:
- a substrate having at least one through hole, and said substrate having a first surface and a second surface opposite to said first surface;
- a first conductive film extending on an inner wall of said at least one through hole;
- at least one first-side circuit wiring extending on said first surface of said substrate;
- at least one second-side circuit wiring extending on said second surface of said substrate;
- at least one first-side protection film covering said at least first-side circuit wiring on said fist surface of said substrate;
- at least one second-side protection film covering said at least second-side circuit wiring on said second surface of said substrate;
- at least one first-side land extending on said first surface of said substrate, and said at least one first-side land extending adjacent to a first-side opening of said at least one through hole, and said at least one first-side land being connected with said first conductive film and also with said at least one first-side circuit wiring;
- at least one second-side land extending on said second surface of said substrate, and said at least one second-side land extending adjacent to a second-side opening of said at least one through hole, and said at least one second-side land being connected with said first conductive film and also with said at least one second-side circuit wiring;
- at least one first-side coating layer extending on said first surface of said substrate, and said at least one first-side coating layer coating at least one part of an outer peripheral region of said at least one first-side land;
- and
- at least one second-side coating layer extending on said second surface of said substrate, and said at least one second-side coating layer coating at least one part of an outer peripheral region of said at least one second-side land.
8 more elements
An electronic device comprising:
- a wiring board having at least one through hole;
- and
- an electronic part being mounted on said wiring board, and said electronic part having at least one lead being inserted into said at least one through hole and being bonded to said at least one through hole via a lead-less solder, and
- wherein said wiring board includes:
- a substrate having said at least one through hole;
- at least one land extending on at least one surface of said substrate, and said at least one land extending adjacent to an opening of said at least one through hole;
- and
- at least one coating layer which coats at least one part of an outer peripheral region of said at least one land, so that said at least one part of said outer peripheral region of said at least one land is separated from said lead-less solder.
5 more elements
An electronic device comprising:
- a wiring board having at least one through hole;
- and
- an electronic part being mounted on said wiring board, and said electronic part having at least one lead being inserted into said at least one through hole and being bonded to said at least one through hole via a lead-less solder, and
- wherein said wiring board includes:
- a substrate having said at least one through hole;
- and
- at least one land extending on at least one surface of said substrate, and said at least one land extending adjacent to an opening of said at least one through hole, and
- wherein at least one part of an outer peripheral region of said at least one land is separated frog said lead-less solder.
5 more elements
An electronic device comprising:
- a wiring board having at least one through hole;
- and
- an electronic part being mounted on said wiring board, and said electronic part having at least one lead being inserted into said at least one through hole and being bonded to said at least one through hole via a lead-less solder, and
- wherein said wiring board includes:
- a substrate having said at least one through hole;
- and
- at least one land extending on at least one surface of said substrate, and said at least one land extending adjacent to an opening of said at least one through hole, and
- wherein a projecting length of said at least one lead from said at least one surface of said substrate is not greater than one half of a horizontal size of said at least one land, where said projecting length is defined to be a length of a projecting part of said at least one lead, which projects from said at least one surface of said substrate, and said land is in contact with a flat fillet of said lead-less solder.
5 more elements
An electronic device comprising:
- a wiring board having at least one through hole;
- and
- an electronic part being mounted on said wiring board, and said electronic part having at least one lead being inserted into said at least one through hole and being bonded to said at least one through hole via a lead-less solder, and
- wherein said wiring board includes:
- a substrate having said at least one through hole;
- and
- at least one land extending on at least one surface of said substrate, and said at least one land extending adjacent to an opening of said at least one through hole, and
- wherein said at least one lead comprises:
- a first-side projecting portion which projects from a first surface of said substrate, and said first surface facing to said electronic part;
- and
- an insertion portion which is within said at least one through hole;
- and
- a second-side projecting portion which projects from a second surface of said substrate, and
- wherein at least an adjacent part of at least one of said first-side projecting portion and said second-side projecting portion is coated with a coating film which has a lower reactivity to said lead-less solder in a melt state than said at least one lead, and said adjacent part is adjacent to said insertion portion.
11 more elements
A method of mounting an electronic part having at least one lead onto a wiring board having at least one through hole for allowing an insertion of said at least one lead, and said method including the steps of:
- forming at least one coating film which coats at least one of an outer peripheral region of at least one land on at least one surface of a substrate of said wiring board;
- placing said electronic part onto said wiring board, so that said at least one lead inserts into said at least one through hole;
- and
- bonding said at least one lead to said at least one through hole by a soldering process using a lead-less solder,
- wherein said at least one of said outer peripheral region of said at least one land is separated by said at least one coating film from said lead-less solder.
2 more elements
A method of mounting an electronic part having at least one lead onto a wiring board having at least one through hole for allowing an insertion of said at least one lead, and said method including the steps of:
- forming at least one spacer on a first surface of said substrate of said wiring board;
- placing said electronic part onto said at least one spacer, so that said at least one lead inserts into said at least one through hole, wherein a second-side projecting length of a second-side projecting portion of said at least one lead from a second surface of said substrate is not greater than one half of a horizontal size of said at least one land on said second surface, where said second-side projecting length is defined to be a length of said second-side projecting portion, which projects from said second surface of said substrate;
- and
- bonding said at least one lead to said at least one through hole by a soldering process using a lead-less solder,
- wherein said at least one land is in contact with a flat fillet of said lead-less solder.
2 more elements
A method of mounting an electronic part having at least one lead onto a wiring board having at least one through hole for allowing an insertion of said at least one lead, and said method including the steps of:
- shortening an original length of said at least one lead of said electronic part to form at least one length-shortened lead of said electronic part;
- placing said electronic part onto said at least one spacer, so that said at least one length-shortened lead inserts into said at least one through hole, wherein a second-side projecting length of a second-side projecting portion of said at least one length-shortened lead from a second surface of said substrate is not greater than one half of a horizontal size of said at least one land on said second surface, where said second-side projecting length is defined to be a length of said second-side projecting portion, which projects from said second surface of said substrate;
- and
- bonding said at least one lead to said at least one through hole by a soldering process using a lead-less solder,
- wherein said at least one land on said second surface is in contact with a flat fillet of said lead-less solder.
2 more elements
A method of mounting an electronic part having at least one lead onto a wiring board having at least one through hole for allowing an insertion of said at least one lead, and said method including the steps of:
- forming at least one coating layer on a first surface of said substrate of said wiring board;
- placing said electronic part onto said at least one coating layer, so that said at least one lead inserts into said at least one through hole, wherein a second-side projecting length of a second-side projecting portion of said at least one lead from a second surface of said substrate is not greater than one half of a horizontal size of said at least one land on said second surface, where said second-side projecting length is defined to be a length of said second-side projecting portion, which projects from said second surface of said substrate;
- and
- bonding said at least one lead to said at least one through hole by, a soldering process using a lead-less solder,
- wherein said at least one land is in contact with a flat fillet of said lead-less solder.
2 more elements
A method of mounting an electronic part having at least one lead onto a wiring board having at least one through hole for allowing an insertion of said at least one lead, and said method including the steps of:
- forming at least one coating film which coats at least an adjacent part of at least one of a first-side projecting part and a second-side projecting part of said at least one lead, wherein said at least one coating film has a lower reactivity to a lead-less solder in a melt state than said at least one lead,
- placing said electronic part over said first surface of said substrate, so that said at least one lead inserts into said at least one through hole, and an insertion region of said at least one lead is in said at least one through hole, and said first-side projecting part projects from a first surface of a substrate of said wiring board, and said second-side projecting part projects from a second surface of said substrate;
- and
- bonding said at least one lead to said at least one through hole by a soldering process using a lead-less solder,
- wherein said insertion region of said at least one lead is in contact with said lead-less solder, and no fillet is formed on said at least one coating film.
2 more elements
Dependencies are inferred from the claim text.