Liquid material evaporation apparatus for semiconductor manufacturing

#This application is based on an application number 2002-069111 filed in Japan, the content of which is hereby incorporated by reference.

#1. Field of the Invention

#The present invention relates to a liquid material evaporation apparatus for use in semiconductor manufacturing.

#The exact nature of this invention will be readily apparent from consideration of the following detailed description in conjunction with the accompanying drawings, wherein:

#FIG. 1 schematically illustrates one example of the entire structure of a liquid material evaporation apparatus, wherein (A) is a top view and (B) is a front view;

#FIG. 2 is an enlarged longitudinal cross-sectional view schematically illustrating the structure of the main portion of the liquid material evaporation apparatus according to the present invention;

#Details of the present invention are explained in reference to the attached drawings that are meant not to limit the disclosure, but rather to illustrate various features. FIGS. 1-4 illustrate one embodiment of the present invention. In reference to FIG. 1, the control valve 1 provides a liquid flow control function. The structure of the control valve 1 is explained referring to FIG. 2 to FIG. 4. The main body block 2 is in the shape of a rectangular parallelepiped constructed from a material with good heat conductivity and corrosion resistance, such as stainless steel. Three flow passages 3, 4, 5 are formed inside the main body block, and a gas-liquid mixing chamber 6 is formed in the upper surface 2a.

#The flow passage 3 is for introducing the liquid material LM into a gas-liquid mixing chamber 6, and this liquid material introduction passage 3 is in the shape of an L character so that one end is opened to a front side surface 2b of the main body block 2 and the other end is opened to the gas-liquid mixing chamber 6 in an upper surface 2a of the main body block 2.

#The flow passage 4 is for introducing a carrier gas CG into the gas-liquid mixing chamber 6, and this carrier gas introduction passage 4 is in the shape of a reverse-L character so that one end is opened to a left side surface 2c of the main body block 2 and the other end is opened to the gas-liquid mixing chamber 6. A nozzle 7 is formed between the end of the carrier gas introduction passage 4 and the gas-liquid mixing chamber 6, in close proximity to the mixing chamber. The term nozzle includes any narrowing of the conduit, but especially a narrow conduit that has a longer dimension along the direction of flow. The nozzle 7, also called a backflow prevention nozzle, prevents backflow of the liquid material LM into the carrier gas introduction passage 4.