Twist-N-Lock wafer area pressure ring and assembly for reducing particulate contaminant in a plasma processing chamber

In a plasma processing chamber, a confinement ring coupling arrangement for coupling a confinement ring to a plurality of plungers, said plurality of plungers being configured to move said confinement ring to deploy and stow said confinement ring to facilitate processing of a substrate within said plasma processing chamber, said confinement ring coupling arrangement comprising:

• a plurality of hanger adapters, each of said plurality of hanger adapters having a locking head, said each of said plurality of hanger adapter being configured to be coupled with said a respective one of said plurality of plungers;
• and
• a plurality of hanging bores disposed in said confinement ring, each of said plurality of hanging bores being configured to receive one of a plurality of locking heads of said plurality of hanger adapters and to secure said one of said plurality of locking heads within said each of said plurality of hanging bores during stowing and deployment of said confinement ring, wherein a diameter of said each of said plurality of locking heads is sufficiently smaller than a cross-section dimension of a respective hanging bore of said plurality of hanging bores within which said each of said plurality of locking heads is disposed to prevent a sidewall of said respective hanging bore from scraping against a sidewall of said each of said plurality of locking heads during said stowing and deployment of said confinement ring.