Systems and methods for bonding a heat sink to a printed circuit assembly
AssigneeAgilent Technologies, Inc.
InventorsWilliam R. Huseby, John Barker, Joseph Groshong
Life of this patent
Estimating the term…
Abstract
A bonding system is provided that bonds a heat sink to a printed circuit assembly. The bonding system includes an adhesive applicator that is configured to hold an adhesive layer, and a heat sink holder that is configured to hold a heat sink while the adhesive applicator applies the adhesive layer to the heat sink.
Claims18
A bonding system for bonding a heat sink to a printed circuit assembly, said bonding system comprising:
- an adhesive applicator having a first compliant surface and an opposing second surface, the first compliant surface being sized and shaped to receive a pressure sensitive adhesive layer;
- a pressure applicator engaging the adhesive applicator, the first surface of the pressure applicator engaging the second surface of the adhesive applicator and being operative to apply pressure to the adhesive applicator in response to receiving a compressive force via the second surface of the pressure applicator and to apply at least a portion of the force to the adhesive applicator;
- and
- a heat sink holder having a recessed portion sized and shaped to receive the heat sink and to maintain a position of the heat sink while the printed circuit assembly is being bonded to the heat sink.
A bonding system for bonding a heat sink to a printed circuit assembly, comprising:
- an adhesive applicator having a compliant surface, the compliant surface having a curved shape and being configured to hold an adhesive layer, the compliant surface being further configured to deform while the adhesive layer is being applied to the heat sink, and to regain its curved shape after the adhesive layer is applied to the heat sink.
A method for bonding a heat sink to a printed circuit assembly, comprising:
- pressing an adhesive layer against a first portion of the heat sink;
- and
- subsequently pressing the adhesive layer against a second portion and a third portion of the heat sink, where the second portion and the third portion are on opposing sides of the first portion.
A method for bonding a heat sink to a printed circuit assembly, comprising:
- removing a first protective layer from an adhesive layer;
- pressing the adhesive layer against the heat sink;
- removing a second protective layer form the adhesive layer;
- and
- pressing the printed circuit assembly against the adhesive layer.
Dependencies are inferred from the claim text.