Process of fabricating a precision microcontact printing stamp

#1. Field of the Invention

#The present invention is directed to a formation of a microcontact printing stamp employed in the creation of microcircuitry where dimensional integrity and registration must be maintained at the micron level over very large distances that may be as long as half a meter. More particularly, the present invention is directed to a process of preparing a high precision microcontact printing stamp based on temporary rigid immobilization of the printing stamp backplane by glue lamination during curing.

#2. Background of the Prior Art

#The present invention may be better understood by reference to accompanying drawings of which:

#FIG. 1 is a sectional elevation view of a mold prior to the introduction of an elastomeric monomer;

#FIG. 2 is an exploded sectional view of one of components illustrated in FIG. 1;

#The recently developed process of microcontact printing, often called “soft-lithography,” requires the preparation of a very fine pitch pattern on the surface of a rubber stamp. It is to this preparation that the present invention is directed.

#The process of preparing a very fine pitch pattern on the surface of a rubber stamp occurs in a molding process. In this molding process a mold housing 1 is provided into which a photoresist master assembly 20, which includes a photoresist master 3, defining the desired microcircuit, disposed upon and affixed to a rigid substrate 2, is predisposed above a flexible stamp backing assembly 15 which is more commonly referred to as a backplane assembly 15. Backplane assemblies of the prior art were limited to a flexible member or, in an attempt to overcome the problems associated with the flexibility of the backplane, the backplane was disposed, in a non-adhering manner, upon a rigid plane, such as glass. It was originally believed that the pressure of the subsequent monomer or oligomer injection process flattened the backplane down against the rigid glass member and held it there. Actual experience has shown that injection pressure is inadequate.

#In the present invention, the backplane assembly 15 is a laminate of a flexible backplane 4 bonded to a flat and rigid planar member 5. As shown in FIG. 2, the backplane laminate assembly 15 is formed by disposing backplane 4 upon a flat and rigid sheet 5. An adhesive 11 is disposed between the backplane 4 and the sheet 5.