Substrate processing method and substrate processing apparatus

A substrate processing apparatus comprising:

• a chamber;
• a substrate rotating mechanism disposed in the chamber for rotating a substrate with the substrate held almost horizontally;
• a lower surface processing liquid discharge nozzle disposed in the chamber for discharging a processing liquid toward a lower surface of the substrate rotated by the substrate rotating mechanism;
• an upper surface processing liquid discharge nozzle disposed in the chamber for discharging a processing liquid toward an upper surface of the substrate rotated by the substrate rotating mechanism;
• and
• a discharge control section for selectively switching, when the substrate is rotated by the substrate rotating mechanism, a peripheral edge processed state where the processing liquid is discharged from the lower surface processing liquid discharge nozzle to process a peripheral edge of the substrate and a both-surface processed state where the processing liquids are simultaneously discharged from the lower surface processing liquid discharge nozzle and the upper surface processing liquid discharge nozzle to process both the surfaces of the substrate, to control the discharge.