Padded clamp ring with edge exclusion for deposition of thick AlCu/AlSiCu/Cu metal alloy layers
AssigneeSTMicroelectronics S.r.l.
InventorArdeshir Jehangir Sidhwa
Life of this patent
Estimating the term…
Abstract
A substrate clamp ring has an edge exclusion lip with a variable bottom surface. At least a portion of that bottom surface has a height above the substrate contact level selected to minimize accumulation over time of deposited aluminum-copper alloy across lower portions of the bottom surface, and to allow the aluminum-copper alloy to be deposited to a thickness of at least 2 microns on each of a predetermined number of substrates without bridging. The height of the bottom surface at an innermost edge of the lip is preferably about 17 mils, while a height of the bottom surface over the substrate edge is preferably about 8.5 mils.
Claims20
A clamp ring for securing a substrate comprising:
- a body;
- one or more substrate contacting surfaces projecting from the body;
- and
- an edge exclusion lip projecting from the body, the lip sized and adapted to project over an edge of any substrate beneath the one or more contacting surfaces, the lip spaced from the substrate at an innermost edge of the lip by a first distance and spaced from the substrate at the substrate edge by a second distance smaller than the first distance,
- wherein at least the second distance permits deposition of a layer of pre-selected material to a predefined thickness on each of a predetermined number of substrates secured by the clamp ring without bridging between the substrate and the clamp ring.
A clamp ring for securing a substrate comprising:
- a body;
- one or more substrate contacting surfaces projecting from the body;
- and
- an edge exclusion lip projecting from the body, the lip sized and adapted to project over an edge of any substrate beneath the one or more contacting surfaces, the lip spaced from the substrate at an innermost edge of the lip by a first distance and spaced from the substrate at the substrate edge by a second distance smaller than the first distance,
- wherein at least the second distance is selected based on a material to be deposited on substrates secured by the clamp ring.
A clamp ring for securing a substrate comprising:
- a body;
- one or more substrate contacting surfaces projecting from the body;
- and
- an edge exclusion lip projecting from the body, the lip sized and adapted to project over an edge of any substrate beneath the one or more contacting surfaces, the lip spaced from the substrate at an innermost edge of the lip by a first distance and spaced from the substrate at the substrate edge by a second distance smaller than the first distance,
- wherein at least the second distance is selected based on a thickness of layers to be deposited on substrates secured by the clamp ring.
A clamp ring for securing a substrate comprising:
- a body;
- one or more substrate contacting surfaces projecting from the body;
- and
- an edge exclusion lip projecting from the body, the lip sized and adapted to project over an edge of a substrate secured by the clamp ring, the lip including a bottom surface extending over the substrate edge toward an innermost edge of the lip,
- wherein at least a portion of the bottom surface is sloped from a first height at one end closest to the innermost edge of the lip to a second height smaller than the first height at an other end closest to the substrate edge.
A clamp ring comprising:
- a roof having upper and lower surfaces;
- at least one substrate contacting surface extending downwardly from the lower roof surface;
- and
- a lip forming an inner terminus of the roof, wherein the lip is sized and adapted to extend inwardly over the edge of a substrate while remaining vertically spaced from the substrate, the lip having a variable lower surface comprising at least first and second lower surfaces, the first surface disposed inwardly from the second surface,
- wherein a height of at least the second lower surface is selected to minimize accumulation over time of deposited material on a sidewall adjacent the second lower surface resulting from depositing the material to a desired thickness on each of a plurality of substrates sequentially secured by the clamp ring.
A method of depositing material on a substrate, comprising:
- securing the substrate utilizing a clamp ring having a lip projecting over an edge of the substrate, the lip including a variable bottom surface with a lower roof height greater than 7 mils;
- and
- depositing aluminum-copper alloy to a thickness greater than 2 microns on portions of the substrate left exposed by the clamp ring.
Dependencies are inferred from the claim text.