Measurement module
OwnerMichael Abraham, Oliver Depner +2inventors
InventorsMichael Abraham, Oliver Depner, Dietrich Drews, Michael Schweiger
Life of this patent
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Abstract
A measurement module for measuring particularly the surface of wafers is described, which comprises a measuring device and a measuring table that has a wafer table equipped with a rotary drive. The design of this measurement module should be as compact as possible. To this end, the wafer table (10) is cup-shaped with at least one support edge (13, 14) for a wafer (4, 4a, 4b), which is provided with an adhesive material. A wafer aligning device (30) is arranged in the interior of the wafer table (10). A displaceable measuring head (7) in which a measuring device and a notch detector are integrated is disposed above the wafer table.
Claims12
Measurement module for measuring particularly the surface of wafers, comprising a measuring device and a measuring table that has a wafer table equipped with a rotary drive, characterized in that the wafer table (10) is cup-shaped and has at least one support edge (13, 14) for a wafer (4, 4a, 4b), which is provided with an adhesive material, that in the interior of the wafer table (10) a wafer alignment device (30) is arranged, and that over the wafer table, a displaceable measuring head (7) is arranged in which a measuring device and a notch detector (20) are integrated.
Dependencies are inferred from the claim text.