Analysis method of film thickness distribution and design system of printed circuit board and manufacturing processes

An analysis method of film thickness distribution for analyzing the distribution of film thickness of the deposited metal formed by electroplating method for selectively depositing metal on a printed circuit board, comprising the step of:

• hypothetically dividing one or more printed circuit boards into one or more desired regions to get the area Sj of a desired region j and an area Aj of the plated surface inside said area j;
• introducing the pattern density θj=Aj/Sj defined by the ratio Aj/Sj in the equation representing the boundary conditions of said area j;
• and
• setting different boundary conditions corresponding to the pattern density θj for each region j.

A design system of printed circuit boards and manufacturing processes, comprising:

• a designation unit for designating a desired film thickness distribution to said printed circuit board and designating the plating process;
• an analysis system creating unit for setting the pattern density θj=Aj/Sj defined by the ratio Aj/Sj (where Sj represents the area of a desired region j, and Aj represents an area of the plated surface inside said area j,) by hypothetically dividing said printed circuit board into desired regions;
• a film thickness distribution analyzing unit for calculating film thickness distribution using said pattern density;
• an output unit for outputting said film thickness distribution;
• and
• a film thickness distribution evaluation unit for comparing said film thickness distribution and said desired film thickness distribution.