Systems and methods for wideband active probing of devices and circuits in operation

#The present invention is generally related to monitoring and testing of integrated circuit devices and, more particularly, is related to systems and methods for wideband active probing of devices and circuits in operation.

#Continuing advances in integrated circuit (“IC”) technology are a major cause of the demand for improved systems and methods to monitor and/or test IC devices. For example, chips that are mounted on printed circuit boards (“PCBs”) are being developed with higher component densities and smaller physical dimensions. In turn, the chip packages, i.e. the chip housing and electrical connectors, are being designed in more complex and compact configurations. A ball grid array (“BGA”), a chip package that uses an array of solder balls for the electrical connectors, is a typical example of such complex and compact chip package configurations. Other chip package configurations continue to use pins for electrical connectors, but the pins are smaller and arranged to tighter tolerances, and thus, such configurations are also becoming more complex and compact.

#IC devices are also being developed that have increased performance characteristics. For example, as IC technology advances, central processing unit (“CPU”) chips, for example that are utilized in computers, are being developed to have increased processing speeds. Furthermore, communication buses that interconnect internal IC devices within a computer system are being developed to support increased speed and bandwidth performance.

#Many aspects of the invention can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present invention. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

#FIG. 1A is a perspective view of an embodiment of a probe amplifier unit.

#FIG. 1B is a perspective view of an embodiment of a probe amplifier unit connected to a differential probe unit.

#Having summarized the invention above, reference is now made in detail to the figures which depict exemplary embodiments of the invention. Referring to FIG. 1A, a perspective view of an embodiment of a probe amplifier unit 102 is shown. The probe amplifier unit 102 includes an enclosure, housing, or other structure that encloses probe amplifier circuitry (not shown). Typically, such probe amplifier circuitry supports a wideband active probing system that provides high bandwidth signal reception and low loading of connected probe tips. For example, the probe amplifier circuitry housed within the probe amplifier unit 102 may provide a probing bandwidth of at least 3 GHz.

#The probe amplifier unit 102 may be constructed of various materials. For example, the probe amplifier unit 102 may be constructed of various types of plastic material. Other materials may be used to construct the probe amplifier unit 102 within the scope of the invention. Such other materials preferably should not interfere with the operation or use of the probe amplifier unit 102.

#A power supply/signal transmission cable 104 is typically connected to the probe amplifier unit 102. The power supply/signal transmission cable 104 typically includes cable insulation or sheathing that covers various conductors. For example, the power supply/signal transmission cable 104 may contain a coaxial conductor 105, such as a coaxial cable, for transmission of signals. Additionally, the power supply/signal transmission cable 104 may contain one or more power conductors 106, such as insulated copper conductors that are solid or stranded in configuration. Typically, the power conductors 106 contained within the power supply/signal transmission cable 104 are configured to provide DC electrical power to the probe amplifier unit 102. Thus, for example, the power conductors 106 may include a positive conductor, a negative conductor, and a ground conductor. However, the power conductors 106 may also include additional conductors for the purpose of providing electrical power to the probe amplifier unit 102. The power supply/signal transmission cable 104 may additionally include other conductors for various purposes such as, for example, to transmit control signals to/from the probe amplifier unit 102. It is noted that in some embodiments (not depicted), the foregoing various conductors may not be contained within a cable or within just a single cable. Further, the power supply/signal transmission cable 104 and/or the various conductors contained therein may include other types of cables or conductors that serve the aforementioned purposes.