Heat-dissipating silicone grease composition
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsKunihiro Yamada, Osamu Uchida
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Abstract
To provide a highly reliable heat-dissipating silicone grease composition having stable thermoconductive properties over a long period of time, which does not exude oil, and which does not lead to contact defects. The heat-dissipating silicone grease composition, comprising: (A) 100 weight parts of an organopolysiloxane having a thixotropicity degree α of 1.03-1.50 and a viscosity at 25° C. of 100-1,000,000 mm2/s, and (B) 100-2,000 weight parts of a thermoconductive inorganic filler having an) average particle diameter of 0.1-100 micrometers.
Claims10
A heat-dissipating silicone grease composition, comprising:
- (A) 100 weight parts of an organopolysiloxane having a thixotropicity degree α of 1.03-1.50 and a viscosity at 25° C. of 100-1,000,000 mm2/s, and
- (B) 100-2,000 weight parts of a thermally conductive inorganic filler having an average particle diameter of 0.1-100 micrometers.
Dependencies are inferred from the claim text.