Benchtop processing

#1. Field of Invention

#This invention generally relates to semiconductor manufacturing and, more particularly, to an apparatus and method for rapid thermal processing of a semiconductor wafer.

#2. Related Art

#FIG. 1 is a perspective view of a benchtop processing system in accordance with one embodiment of the present invention;

#FIGS. 2A and 2B are a perspective view and a top view, respectively, of the interior of a wafer reception module of the benchtop processing system of FIG. 1 in accordance with one embodiment of the present invention;

#FIG. 2C is a side view of the bench top processing system of FIG. 1 in accordance with one embodiment of the present invention;

#The use of similar reference numerals in different figures indicates similar or identical items.

#FIG. 1 is a perspective view of a processing system 100 that establishes a representative environment of the present invention. Processing system 100 is referred to as a “benchtop” processing system due to its reduced size relative to other processing systems. As described in detail below, the benchtop processing system can be used to process from one to about five wafers per processing cycle. The benchtop processing system also provides the ability to manually manipulate wafers. The benchtop processing system does not require robotic manipulation of wafers, but can rather be loaded manually by the operator.

#In one embodiment, benchtop processing system 100 includes a wafer reception module 102, gate valve assembly 104, and processing chamber 106. In accordance with the present invention, wafer reception module 102 has a door 108 rotatable about hinges 110. In one embodiment, an operator can open door 108 by hand to load a single wafer or optionally, multiple wafers, into processing system 100.