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AssigneeCanon Kabushiki Kaisha
InventorsAya Imada, Tohru Den
Estimating the term…
A structure having recesses and projections is provided. A method of manufacturing the structure comprises the steps of preparing a first substrate having a projection, forming a first layer on the projection, transferring the first layer to a second substrate, and forming a recessed/projected surface structure in the second substrate by using the first layer.
A method of manufacturing a structure, comprising the steps of:
A method of manufacturing a structure, comprising the steps of:
Dependencies are inferred from the claim text.
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Surface micromachining, i.e. structuring layers on the substrate: using stamping, e.g. imprinting
Nanotechnology for information processing, storage or transmission
Manufacture or treatment of nanostructures
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g.…
Term end not estimated
1. Field of the Invention
The present invention relates to a structure having recesses and projections, a method of manufacturing the structure, and a functional device utilizing the structure. Also, the present invention relates to a method of manufacturing a nano-structure having a nano-scale pitch.
2. Description of the Related Art
FIGS. 1A to 1D are schematic views showing steps of a method of manufacturing a structure having recesses and projections according to the present invention.
FIGS. 2A to 2C are schematic views showing steps of an embodiment (one example) of a method of manufacturing a nano-structure of the present invention.
FIG. 3 is an explanatory view showing another example of the method of manufacturing the nano-structure of the present invention.
A method of manufacturing a structure having recesses and projections, according to the present invention, comprises the steps described below with reference to FIGS. 1A to 1D.
The structure according to the present invention is manufactured by the steps of preparing a first substrate 1000 having projections 1010 (FIG. 1A), forming a first layer 1020 on the projections 1010 (FIG. 1B), transferring the first layer 1020 to a second substrate 2000 (FIG. 1C), and forming a recessed/projected surface structure 2020 in the second substrate by employing the first layer 1020 (FIG. 1D).
While the first layer 1020 is formed only on the projections 1010 in FIG. 1B, it may be formed in recesses as well. Also, while the first substrate 1000 is not shown in FIG. 1D as being moved away from the first layer 1020, the first substrate may be not moved away from the first layer.