Semiconductor device and method for the fabrication thereof

A method for the fabrication of a semiconductor device comprising the steps of:

• preparing a first semiconductor element having a major surface on which a plurality of first element electrodes are disposed and a second semiconductor element having a major surface on which a plurality of second element electrodes are disposed;
• placing said first and second semiconductor elements such that their said major surfaces face each other, and thereafter electrically connecting together at least a portion of said plural first element electrodes of said first semiconductor element and at least a portion of said plural second element electrodes of said second semiconductor element by a connection member;
• forming an insulation layer coating a backside surface of said second semiconductor element and said major surface of said first semiconductor element;
• forming in said insulation layer an opening portion exposing at least a portion of said plural first element electrodes;
• and
• forming on said insulation layer a wiring layer which is electrically connected to said first element electrode exposed in said opening portion, a portion of said wiring layer functioning as an external electrode electrically connectable to external equipment.