Semiconductor test system with easily changed interface unit
AssigneeTeradyne, Inc.
InventorsMichael A. Chiu, Neil R. Bentley, Wayne Petitto
Life of this patent
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AssigneeTeradyne, Inc.
InventorsMichael A. Chiu, Neil R. Bentley, Wayne Petitto
Estimating the term…
A subassembly to aid in changing the interface unit for an automatic test system. The disclosed embodiment shows an automatic test system with a handler and a tester. The interface unit is a device interface board (DIB). The subassembly allows the DIB to be easily accessed, yet can be properly aligned to the test system. No special tools are required to change the DIB.
An automatic test system comprising a subassembly adapted for use in changing an interface unit, the subassembly comprising:
A method of manufacturing semiconductor devices with ATE that includes a material handling unit and a tester that mate at a mating area, and an interface unit in the mating area, the ATE further including a subassembly for positioning the interface unit, the method comprising
A method of manufacturing semiconductor devices with ATE that includes a material handling unit, a tester that mate at a mating area, and an interface unit in the mating area, the ATE further including a subassembly for positioning the interface unit, the method comprising:
Dependencies are inferred from the claim text.
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Features relating to contacting the IC under test, e.g. probe heads; chucks: interfaces, e.g. between probe and tester
Tester configuration: interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by…
Specific tests of electronic circuits not provided for elsewhere: automated test systems [ATE]; using microprocessors or computers
Term end not estimated
This invention relates generally to manufacture of semiconductor devices and more particularly to interface units used to interface a test system to a device under test.
In the manufacture of semiconductor devices, the semiconductor devices are usually tested at least once during the manufacturing operation. The results of the testes are used to control further processing in the semiconductor manufacturing operation. The testing might be used to separate properly operating devices from devices that fail to operate properly. However, testing can also be used to feed back data to other stages in the manufacturing operation to make adjustments that increase the yield of properly operating devices. In other instances, the test results are used to sort devices into performance categories. For example, a device might operate at data rates of 200 MHz, but not operate at data rates of 400 MHz. Following testing, the device might be classified as a 200 MHz device and sold at a lower price than a 400 MHz device.
A testing stage might also be used to make physical changes to the device under test. Many semiconductor devices with memories contain redundant elements. If defective memory cells are discovered during testing, the semiconductor device might be sent to a repair station, such as a laser repair station, where connections on the device are rearranged to disconnect the faulty cells and connect redundant elements in their places.
The invention will be better understood by reference to the following more detailed description and accompanying drawings in which
FIG. 1 is a sketch of a handler incorporating a DIB changer according to the invention;
FIG. 2 is sketch of the DIB changer of FIG. 1 in greater detail;
FIG. 1 shows a material handling unit suitable for use in a semiconductor manufacturing operation. Here, a handler 100 is illustrated. Handler 100 moves packaged parts to a test system (310, FIG. 3).
Handler 100 includes an interface area 102, where handler 100 interfaces to a test system. The interface area of a handler typically includes mechanical alignment and support structures so that a tester may be docked to the handler. Here, interface area 102 falls in a vertical plane. Alignment features 104 are shown for aligning handler 100 and the tester.
Preferably, the alignment features create a kinematic coupling as described in U.S. Pat. No. 5,821,764, entitled “Interface Apparatus for Automatic Test Equipment,” which is hereby incorporated by reference. The interface apparatus described in this patent aligns the tester and the handler. In addition, that interface apparatus allows a force to be generated to pull the tester towards the handler and hold it in position.