Deposition of a projection structure on a substrate using a negative mask and negative photoresist
AssigneeInternational Business Machines Corporation
InventorsAlfred F. Renaldo, Douglas J. Werner
Life of this patent
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Abstract
A projection structure is deposited on a substrate having a top surface by applying a negative photoresist overlying the substrate, and positioning a mask overlying the substrate and lying in a mask plane generally parallel to the top surface. The mask is a negative mask that is opaque in a region defining a location where the projection structure is to be deposited. The method further includes exposing the negative photoresist through the mask, baking and developing the exposed negative photoresist, and depositing the projection structure through the exposed and etched negative photoresist.
Claims18
A method for depositing a projection structure, comprising the steps of
- furnishing a substrate having a top surface;
- thereafter
- applying a negative photoresist overlying the substrate;
- positioning a mask overlying the substrate, the mask being opaque in a region defining a location where the projection structure is to be deposited;
- thereafter
- exposing the negative photoresist through the mask to produce an exposed negative photoresist;
- thereafter
- baking and developing the exposed negative photoresist to produce an exposed-and-etched negative photoresist;
- and thereafter
- depositing the projection structure through the exposed and etched negative photoresist.
A method for depositing a projection structure comprising a write portion of a magnetic read/write head, the method comprising the steps of
- furnishing a substrate comprising a read portion of the magnetic read/write head and having a top surface susceptible to reflecting light therefrom;
- thereafter
- applying a negative photoresist overlying the substrate;
- positioning a negative mask overlying the substrate and lying in a mask plane generally parallel to the top surface, the mask being opaque in a region defining a location where the projection structure is to be deposited;
- thereafter
- exposing the negative photoresist through the mask to produce an exposed negative photoresist;
- thereafter
- baking and developing the exposed negative photoresist to produce an exposed-and-etched negative photoresist;
- and thereafter
- depositing the projection structure through the exposed and etched negative photoresist, the projection structure comprising a flared pole portion and a pole-tip projection extending from the flared portion.
A method for depositing a projection structure overlying and extending outwardly relative to a lateral surface of a substrate, comprising the steps of
- furnishing a substrate having a top surface and the lateral surface portion thereof oriented at an angle to a remainder of the top surface;
- applying a negative photoresist overlying the substrate;
- positioning a mask overlying the substrate and parallel to the top surface, the mask being opaque in a region defining a location where the projection structure is to be deposited and overlying at least a portion of the lateral surface;
- patterning the negative photoresist through the mask;
- baking and developing the patterned negative photoresist;
- and
- depositing the projection structure on the top surface of the substrate through the patterned and etched negative photoresist.
Dependencies are inferred from the claim text.