Composite photoresist for pattern transferring
AssigneeUnited Microelectronics Corp.
InventorJui-Tsen Huang
Life of this patent
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Abstract
A composite photoresist structure includes an first organic layer located on a substrate, a sacrificial layer located on the first organic layer, and a second organic layer located on the sacrificial layer. The first organic layer is made of materials that can be easily removed by plasma. Therefore, the surface of the substrate will not be damaged while transferring a predetermined pattern onto the substrate.
Claims30
A composite photoresist structure, comprising:
- a first organic layer disposed over a surface to be etched;
- a sacrificial layer disposed on the first organic layer;
- and
- a second organic layer disposed on the sacrificial layer.
A photoresist structure, suitable for sub-micron pattern transfers in semiconductor processes, the photoresist structure comprising:
- a first organic layer disposed over a surface to be etched;
- a sacrificial layer disposed on the organic layer;
- an anti-reflection layer disposed on the sacrificial layer;
- and
- a second organic layer disposed on the anti-reflection layer.
A method of fabricating a semiconductor device comprising:
- providing a substrate;
- sequentially forming a first organic layer, a sacrificial layer, and a second organic layer on the substrate;
- performing a photolithography process so as to form a predetermined pattern in the second organic layer;
- utilizing the second organic layer as an etching mask for etching the sacrificial layer till a surface of the first organic layer is exposed, thus the predetermined pattern being transferred to the sacrificial layer;
- utilizing the sacrificial layer as an etching mask for etching the first organic layer till a surface of the substrate is exposed, thereby the predetermined pattern being transferred to the first organic layer;
- utilizing the sacrificial layer and the first organic layer as an etching mask for etching the substrate, thereby transferring the predetermined pattern to the substrate;
- removing the first organic layer by use of plasma.
Dependencies are inferred from the claim text.