Back to results
US 2003/0194639 A1Published application
Positive resist composition
AssigneeSumitomo Chemical Company, Limited
InventorsYoshiko Miya, Kouji Toishi, Kazuhiko Hashimoto
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeSumitomo Chemical Company, Limited
InventorsYoshiko Miya, Kouji Toishi, Kazuhiko Hashimoto
Estimating the term…
The present invention provides a positive resist composition comprising a resin which itself is insoluble or poorly soluble in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid, and an acid generator, wherein the content of halogen atoms in the resin is 40% by weight or more, at least one of structural units constituting the resin is a structural unit having an alicyclic hydrocarbon skeleton, and the structural unit having an alicyclic hydrocarbon skeleton contains therein at least one group rendering the resin soluble in an alkali aqueous solution by the action of an acid, and at least one halogen atom.
A positive resist composition comprising a resin which itself is insoluble or poorly soluble in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid, and an acid generator, wherein the content of halogen atoms in the resin is 40% by weight or more, at least one of structural units constituting the resin is a structural unit having an alicyclic hydrocarbon skeleton, and the structural unit having an alicyclic hydrocarbon skeleton contains therein at least one group rendering the resin soluble in an alkali aqueous solution by the action of an acid, and at least one halogen atom.
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Backward citations are indexed for grants only.
Photosensitive materials: with perfluoro compounds, e.g. for dry lithography
Photosensitive materials: with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
The macromolecular compound being present in a chemically amplified positive photoresist composition: the macromolecular compound having a…
Binder containing: polyolefin or halogen containing
Term end not estimated
1. Field of the Invention
The present invention relates to a chemical amplification type positive resist composition.
2. Prior Art
Resin A1
A resin # 010730 which is produced by paratial (30%) methoxymethylation of resin A-1 obtained from Asahi Glass Co., Ltd. was used.
Synthesis Example of Resin A2 (weight-average molecular weight: about 63451) Partial EOM (abbreviation of ethoxymethylation) of Resin A-1 (#011115-2) obtained from Asahi Glass Co., Ltd. (protection ratio 31%)