Printed wiring board and semiconductor device and processes to prepare the same
AssigneeRiken
InventorsYusuke Tajima, Kazuo Takeuchi, Yasuo Shigemitsu, Etsu Takeuchi
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AssigneeRiken
InventorsYusuke Tajima, Kazuo Takeuchi, Yasuo Shigemitsu, Etsu Takeuchi
Estimating the term…
A photosensitive resin composition comprising an oxygen sensitizer and a polyamic acid or a polyimide which has substituents having a cis-diene structure at the side chains; a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating the substrate with the composition and forming fine patterns by exposure of irradiation; and processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device which comprise coating the substrate with the composition and forming fine patterns by crosslinking the cis-diene group by polycondensation with oxidation with the singlet oxygen generated by exposure of irradiation to the oxygen sensitizer in the presence of oxygen. The photosensitive resin composition of the negative type exhibits high sensitivity and high resolution, can form a resin layer having excellent heat resistance and can be applied to production of semiconductor devices and circuit wiring boards. The printed wiring board, the substrate for disposing semiconductor chips and the semiconductor device can be obtained by using the composition. The processes provide the printed wiring board, the substrate for disposing semiconductor chips and the semiconductor device.
A photosensitive resin composition which comprises an oxygen sensitizer and a cis-diene-substituted polyamic acid or polyimide having a structural unit represented by general formula [1]:
A photosensitive resin composition which comprises an oxygen sensitizer and a cis-diene-substituted polyamic acid or polyimide having a structural unit represented by general formula [2]:
A photosensitive resin composition which comprises an oxygen sensitizer and a cis-diene-substituted polyamic acid or polyimide having a structural unit represented by general formula [3]:
A photosensitive resin composition which comprises an oxygen sensitizer and a-cis-diene-substituted polyamic acid or polyimide having a structural unit represented by general formula [4]:
A photosensitive resin composition which comprises an oxygen sensitizer and a cis-diene-substituted polyamic acid or polyimide having a structural unit represented by general formula [5]:
Dependencies are inferred from the claim text.
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Macromolecular compounds which are rendered insoluble or differentially wettable: polyamides or polyimides
Nanotechnology for interacting, sensing or actuating
Nanotechnology for materials or surface science
Reduction of cross-talk, noise or electromagnetic interference: using auxiliary mounted passive components or auxiliary substances
Term end not estimated
1. Field of the Invention
The present invention relates to a photosensitive resin composition, a printed wiring board, a substrate for disposing semiconductor chips, a semiconductor device and processes for producing a printed wiring substrate, a substrate for disposing semiconductor chips and a semiconductor device. More particularly, the present invention relates to a photosensitive resin composition of the negative type which can be applied to production of semiconductor elements and circuit wiring boards, can exhibit high sensitivity and high resolution and can form resin layers having excellent heat resistance; a printed wiring substrate, a substrate for disposing semiconductor chips and a semiconductor device obtained by using the photosensitive resin composition; and processes for producing a printed wiring substrate, a substrate for disposing semiconductor chips and a semiconductor device using the photosensitive resin composition.
2. Description of Related Art
The present invention will be described more specifically with reference to examples in the following. However, the present invention is not limited to the examples.
2-Hydroxy-3-methyl-1,4-phenylenediamine in an amount of 5.41 g (0.0392 mol) and 8.55 g (0.0392 mol) of pyromellitic dianhydride were reacted in 50 ml of N-methyl-2-pyrrolidone at the room temperature and a solution of a polyamic acid having the structural unit expressed by formula [17] was obtained. 19
Separately, 5.00 g (0.0510 mol) of furfuryl alcohol was dissolved in 50 ml of tetrahydrofuran and 4.90 g (0.0181 mol) of phosphorus tribromide was added dropwise to the prepared solution. After the reaction mixture was stirred for about 1.5 hours, water was added to the reaction mixture and the organic component was extracted twice with 100 ml of ether. The ether layer was washed with sodium hydrogencarbonate and sodium chloride, dried with 30 g of molecular sieves overnight and filtered to obtain an ether solution of furfuryl bromide. The product was confirmed to be furfuryl bromide by the analyses of the obtained solution in accordance with 1H-NMR and 13C-NMR.