Loading patent…
AssigneeSemiconductor Engergy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Masakazu Murakami
Estimating the term…
In this embodiment, an interval distance between a desposition source holder 17 and an object on which deposition is performed (substrate 13) is reduced to 30 cm or less, preferably 20 cm or less, more preferably 5 to 15 cm, and a deposition source holder 17 is moved in an X direction or a Y direction in accordance with an insulator (also called a bank or a barrier) in deposition, and a shutter 15 is opened or closed to form a film. The present invention can cope with an increase in size of a deposition apparatus with a further increase in size of a substrate in the future.
A method of fabricating alight-emitting device comprising:
A manufacturing apparatus having a film forming apparatus for depositing a deposition material over a substrate from a deposition source arranged in opposition to said substrate to form a film on the substrate, said manufacturing apparatus comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Backward citations are indexed for grants only.
Characterised by the process of coating: vacuum evaporation
Vacuum evaporation: crucibles for source material
Deposition of organic active material: using liquid deposition, e.g. spin coating
Deposition of organic active material: using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
Term end not estimated
1. Field of the Invention
The present invention relates to a film-forming device for forming a film of materials which can be formed into a film by using a vapor deposition (hereinafter, vapor deposition materials), and a light-emitting device which is typified by EL element. Especially, the present invention is effective in forming a light-emitting device by using organic materials as vapor deposition materials.
2. Description of the Related Art
FIGS. 1A to 1C are diagrams showing an embodiment of the present invention.
FIGS. 2A and 2B are diagrams showing an embodiment of the present invention.
FIG. 3 is a diagram showing an embodiment of the present invention.
Embodiments of the present invention will be described below.
A film forming apparatus is shown in FIGS. 1A and 1B. FIG. 1A is a sectional view in an X direction (section along an A-A′ dotted line), FIG. 1B is a sectional view in a Y direction (section along a B-B′ dotted line), and FIG. 1C is an upper view. FIG. 1B is a sectional view obtained in the middle of film formation.
In FIG. 1, reference numeral 11 denotes a film forming chamber; 12, a substrate holder; 13, a substrate; 14, a deposition mask; 15, a deposition shield (deposition shutter); 17, a deposition source holder; 18, a deposition material; and 19, evaporated deposition material.