Encapsulating brittle substrates using transfer molding
AssigneeAvago Technologies General IP (Singapore) Pte. Ltd.
InventorsCheng Why Tan, Beng Huat Low, Huck Khim Koay
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Abstract
A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.
Claims6
A transfer mold for encapsulating a substrate with an encapsulating material comprising:
- a bottom mold;
- a top mold,
- wherein a space provided between the top mold and bottom mold receives the substrate;
- and
- the top mold and the bottom mold abutted against each other in the presence of a clamping force, thereby distributing the force exerted on the substrate to the top mold and bottom mold.
A transfer mold for encapsulating a substrate with an encapsulating material comprising:
- a bottom mold;
- a top mold,
- wherein a space is provided between the top mold and bottom mold for receiving the substrate;
- a first placing unit for placing the substrate onto the bottom mold;
- a second placing unit for placing the top mold onto the substrate, thereby fitting the substrate at least partially into the space between the top mold and bottom mold;
- a clamping unit for clamping the top mold and bottom mold sufficiently strong towards each other,
- the top mold and the bottom mold arranged so that in the presence of a clamping force, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold
- an injecting unit for injecting the encapsulating material into a cavity in the top mold through at least one opening of the top mold;
- and
- a curing unit for curing the encapsulating material, thereby encapsulating the substrate.
Dependencies are inferred from the claim text.