Processing system for semiconductor wafers
OwnerWoo Sik Yooinventor
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Abstract
A system and method are provided for semiconductor wafer processing. A wafer processing system includes a transfer chamber, a loadlock module connected to the transfer chamber, a plurality of processing modules vertically mounted in-line with the loadlock module, and a wafer transfer apparatus. The wafer transfer apparatus moves a wafer from the loadlock module to at least one of the plurality of processing modules where processing of the wafer takes place. The system and method of the present invention minimize the required clean room space while heightening process control.
Claims21
A wafer processing system comprising:
- a transfer chamber;
- a first loadlock module operably coupled to the transfer chamber;
- a plurality of processing modules operably coupled to the transfer chamber, wherein the plurality of processing modules are vertically mounted in-line with the first loadlock module;
- and
- at least one wafer transfer apparatus having extension and vertical motion operable to transfer a wafer from the loadlock module to the plurality of processing modules.
A wafer processing system comprising:
- a transfer chamber;
- a first loadlock module operably coupled to the transfer chamber;
- a first processing module operably coupled to the transfer chamber, wherein the first processing module is vertically mounted in-line above the first loadlock module;
- a second processing module operably coupled to the transfer chamber, wherein the second processing module is vertically mounted in-line below the first loadlock module;
- and
- at least one wafer transfer apparatus capable of motion along a vertical axis, wherein the motion along a vertical axis can extend to above and to below the first loadlock module.
A method for processing a semiconductor wafer comprising:
- providing a transfer chamber;
- providing a first loadlock module operably coupled to the transfer chamber;
- providing a plurality of processing modules vertically mounted in-line with the first loadlock module;
- moving a wafer from the loadlock module into at least one of the plurality of processing modules using a wafer transfer apparatus;
- and
- processing the wafer.
Dependencies are inferred from the claim text.