Semiconductor laser device

#The present invention relates to a semiconductor laser device.

#Conventionally, there has been a can package type semiconductor laser device as shown in FIG. 4. The semiconductor laser device of FIG. 4 has a two-body structure of a stem 102 and a cap 104. The stem 102 has a block portion 103 on which a laser chip 101 is mounted. This block portion 103 serves as a base on which the laser chip 101 is mounted and concurrently plays the role of efficiently transmitting heat generated from the laser chip 101 to the main body of the stem 102 during operating. Moreover, a laser beam emitted from the laser chip 101 goes out via a window 104c of the cap 104. A windowpane 108 is attached to the window 104c.

#In recent years, owing to the trend toward thickness reduction of optical disk drives, optical pickup devices have been required to have a thin configuration, and semiconductor laser devices have been required to be compacted. In concrete, the standard size of packages of the semiconductor laser devices is 5.6 millimeters in diameter at present, but further reduction thereof is required up to 3.5 millimeters or less in diameter.

#The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention, and wherein:

#FIG. 1 is a front view of a semiconductor laser device according to one embodiment of the present invention;

#FIG. 2 is a side view of the above semiconductor laser device;

#The semiconductor laser device of the present invention will be described in detail below on the basis of embodiments shown in the drawings.

#FIG. 1 is a view of a semiconductor laser device of one embodiment of the present invention, viewed from the laser beam emission side. FIG. 2 is the above semiconductor laser device, viewed from a side.

#As shown in FIGS. 1 and 2, the semiconductor laser device is provided with a laser chip 1 that serves as a laser element, a stem 2 having a block portion 2a on which this laser chip 1 is mounted, and a closed-end cylindrical a cap 4 that is attached to the stem 2 so as to cover the block portion 2a.