Semiconductor memory device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsYasuhiko Tsukikawa, Takuya Ariki, Susumu Tanida, Yukiko Maruyama
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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsYasuhiko Tsukikawa, Takuya Ariki, Susumu Tanida, Yukiko Maruyama
Estimating the term…
A memory cell is formed of a sense access transistor for data sensing, a restore access transistor for data restoration and a memory capacitor for data storage. Sense access transistor couples the memory capacitor to a sense bit line according to a signal on a sense word line. The restore access transistor couples the memory capacitor to a restore bit line provided separate from the sense bit line according to a signal on a restore word line. Electric charges in the memory capacitor are transferred to a sense amplifier through the sense bit line and sense data in a sense amplifier is transferred to original memory capacitor through a restore amplifier and the restore access transistor. Output signal lines of the sense amplifier are electrically isolated from the sense and restore bit lines. Thereby, it is possible to reduce the access time of a semiconductor memory device.
A semiconductor memory device comprising:
A semiconductor memory device comprising:
Dependencies are inferred from the claim text.
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With charge regeneration common to a multiplicity of memory cells, i.e. external refresh: with three charge-transfer gates, e.g. MOS transistors,…
Forming cells needing refreshing or charge regeneration, i.e. dynamic cells: management or control of the refreshing or charge-regeneration cycles
Static stores
Term end not estimated
1. Field of the Invention
The present invention relates to a semiconductor memory device, and particularly to a semiconductor memory device with a memory cell structure storing data in a capacitor in the form of electric charges. More particularly, the present invention relates to a configuration and a memory cell layout for achieving high speed access to a dynamic type memory cell.
2. Description of the Background Art
FIG. 1 is a diagram showing a configuration of a main part of a semiconductor memory device according to a first embodiment of the present invention;
FIG. 2 is a signal waveform diagram representing operations of the semiconductor memory device shown in FIG. 1;
FIG. 3 is a diagram showing cycle times of a semiconductor memory device according to the present invention and a conventional semiconductor memory device;
First Embodiment
FIG. 1 is a diagram showing a configuration of a main part of a semiconductor memory device according to a first embodiment of the present invention. Memory cells 1 are arranged in rows and columns in the open bit line configuration. In FIG. 1, there are representatively shown two memory cells 1R and 1L. To memory cell 1R, there are provided a sense bit line SBL_R and a restore bit line RBL_R and to memory cell 1L, there are provided a sense bit line SBL_L and a restore bit line RBL_L.
Sense bit lines SBL_R and SBL_L are coupled to sense amplifiers 2. Sense amplifier 2, in an active state, differentially amplifies potentials on sense bit lines SBL_R and SBL_L to output the output signals thereof onto sense output lines /D_R and /D_L. Sense output lines /D_R and /SD_L are electrically isolated from sense bit lines SBL_R and SBL_L. Therefore, sense bit line SBL_R and SBL_L only transmit data of a selected memory cell, and data amplified by sense amplifier 2 is not transmitted onto sense bit lines SBL_R and SBL_L.