Board-level EMI shield with enhanced thermal dissipation

An apparatus comprising:

• (a) a substrate having at least one electrical component disposed thereon;
• (b) a plurality of solder spheres disposed on said substrate surrounding said at least one electrical component;
• (c) a board-level electromagnetic interference (EMI) shield comprising at least one compartment adapted to cover said at least one electrical component, said board-level EMI shield further comprising an electrically conductive layer;
• (d) at least one thermally conductive interface (TCI) material disposed over said at least one electrical component;
• (e) a heat sink disposed over said at least one TCI material;
• (f) wherein said electrically conductive layer of said board-level EMI shield is in electrical contact with at least one of said solder spheres, and wherein said board-level EMI shield and said solder spheres combine to limit electromagnetic radiation from entering or exiting said at least one compartment;
• and
• (g) wherein said heat sink and said at least one TCI material combine to dissipate heat from said at least one electrical component.

A board-level electromagnetic interference (EMI) shield for a substrate having at least one electrical component disposed thereon and a plurality of discrete electrically conductive fastening units disposed in a pattern on the substrate surrounding the at least one electronic component, the board-level EMI shield comprising:

• (a) an electrically conductive layer;
• (b) a plurality of apertures formed in said board-level EMI shield such that said apertures correspond to the pattern of the electrically conductive fastening units;
• (c) at least one thermally conductive interface (TCI) material attached to said board-level EMI shield;
• (d) wherein at least one of said apertures has a contact region and wherein said electrically conductive layer of said board-level EMI shield at said contact region of said aperture are deflectable to the extent necessary to allow said contact region to engage and retain at least one of said electrically conductive fastening units;
• and
• (e) wherein said electrically conductive layer of said EMI shield at said contact region is adapted to make electrical contact with at least one said electrically conductive fastening unit.