Positioning and heat dissipating device of interface card

#1. Field of the Invention

#The present invention relates to heat dissipation, and particularly to a positioning and heat dissipating device of an interface card.

#2. Description of Related Art

#FIG. 1 is an exploded view of one embodiment of the present invention.

#FIG. 2 is a perspective view of one embodiment of the heat-dissipating module of the present invention.

#FIG. 3 is an assembled view showing that the present invention is fixed to a computer casing.

#Referring to FIGS. 1 and 2, the exploded perspective view of the present invention is illustrated, wherein the present invention is not assembled to a computer casing 3. The present invention includes an operation platform 1 and at least one heat-dissipating module 2. The heat-dissipating module 2 is fixed to a platform 1. The heat dissipating effect of the heat-dissipating module 2 is corresponding to the interface card 4 in the casing 3 (referring to FIG. 5). The heat-dissipating module 2 has an independent fan 21 and a frame 22 for installing the fan 21. A plurality of sliding grooves 221 are formed on the frame 22. Each sliding groove 221 is installed with a positioning element 23 movable on the sliding groove 221. Especially, the positioning portion 231 on each positioning element 23 presses a respective interface card 4 so as to achieve the effect of positioning the interface card 4.

#In above structure, one end of the platform 1 is pivotally installed with a pivotal shaft 11 for being pivotally connected to a computer casing 3. The platform 1 is openable. This design does not hinder the insertion of the interface card 4. Furthermore, the heat-dissipating module 2 may be well protected and easily assembled. Another end of the platform 1 far away from the pivotal connecting end has a protruded edge for resisting against another end 31 of the casing 3 so that the platform 1 can run across the casing (referring to FIGS. 3, 4 and 5). The platform 1 is fixed to the casing 3 by a locking means 16 nearby the edge 12. One end of the locking means 16 is fixed to the positioning element 23 and another end thereof is a free end. The free end is installed with a resisting portion 161 for resisting a lower side of the casing 3 so that the platform 1 will not move upwards. One end of the resisting portion 161 extends with a top plate 162. A connecting portion 163 is mounted between the resisting portion 161 and the locking means 16, thereby, the resisting portion 161 will be driven by then movement of the top plate 162, as illustrated in FIG. 4. The top plate 162 passes through the through hole 17 in the platform 1, but a gap is remained therebetween so that the top plate 162 may move backwards slightly. When the top plate 162 moves backwards, the resisting portion 161 is driven to separate from the casing 3 so that the platform 1 can be opened.

#The heat-dissipating module 2 is buckled to a buckling hole 13 of the platform 1 through the hook 233 in the frame 22. Thereby, the heat-dissipating module 2 is fixed to the platform 1. Moreover, the platform 1 has a via hole 14 at position with respect to the heat-dissipating module 2. By the operation of the heat-dissipating module 2, the heat from the interface card 4 may have a convection effect with the environmental air. The platform 1 is installed with penetrating holes 15 with respect to the sliding tracks 232 at the two sides of the positioning element 23. Two sides of the positioning element 23 have sliding tracks 232 which are movable with respect to the sliding grooves 221 of the heat-dissipating module 2. A hook 233 is installed between the two sliding tracks 233. The hook 233 is engagable with the teeth 222 of the heat-dissipating module 2 so that the positioning element 23 can be adjusted to a proper position, as shown in the FIG. 6. A bottom of the positioning element 23 has a positioning portion 231. In this embodiment, the positioning portion 231 is a groove for resisting against the interface card 4 and has a positioning effect.