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AssigneesSharp Kabushiki Kaisha, Jsr Corporation
InventorsKazuki Kobayashi, Ikuo Sakono, Shinji Shiraki, Hirofumi Sasaki, Kazuaki Niwa
Estimating the term…
The invention provides a radiation-sensitive resin composition, by which a patterned insulation film whose water repellency varies is easily formed with high precision, a process for forming a patterned insulation film using this composition, a display element and an flat-panel disply device using the composition, and a process for producing the flat-panel disply device. The resin composition comprises (A) an alkali-soluble copolymer, (B) a 1,2-quinonediazide compound and (C) a water-repellent siloxane resin in particular proportions. In the production process of the patterned insulation film, patterning exposure and development are conducted on a coating formed of the resin composition. The display element and flat-panel disply device are equipped with an interlayer insulation film formed by the resin composition. The production process of the flat-panel disply device comprises an interlayer insulation film-forming step including a treatment of patterning exposure exposing conductor layer-forming regions in an exposure that only surface layer portions are cured in one part thereof, and the whole in the thickness-wise direction thereof is cured in the other parts, and a conductor layer-forming step of forming conductor layers on the surface of the interlayer insulation film with a liquid material.
A radiation-sensitive resin composition comprising:
Dependencies are inferred from the claim text.
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Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor: filters, e.g.…
Active matrix addressed cells: through-hole connection of the pixel electrode to the active element through an insulation layer
Macromolecular quinonediazides; Macromolecular additives, e.g. binders: characterised by the polymeric binders or the macromolecular additives…
Silicon-containing compounds: macromolecular compounds containing Si-O, Si-C or Si-N bonds
Term end not estimated
1. Field of the Invention
The present invention relates to a material for forming a protective film or the like used in, for example, electronic parts, particularly, a radiation-sensitive resin composition suitable for use as a material for forming an interlayer insulation film in a liquid crystal display device or the like, a process for forming a patterned insulation film using this radiation-sensitive resin composition, an active matrix board having an interlayer insulation film composed of this radiation-sensitive resin composition, a flat-panel display device equipped with this active matrix board, and a process for producing the flat-panel display device.
2. Description of the Background Art
FIG. 1 is a plan view illustrating the construction of a mask used upon an exposure treatment in an experimental Example performed for demonstrating the effects of the radiation-sensitive resin composition according to the present invention;
FIG. 2 diagrammatically illustrates the relationship between a difference in contact angle with purified water between an exposed region and an unexposed region, and the percentage of success of selective coating of the liquid material;
FIG. 3 diagrammatically illustrates the relationship between a difference in level between the exposed region and the unexposed region, and the percentage of success of selective coating of the liquid material;
The present invention will hereinafter be described specifically.
[Radiation-Sensitive Resin Composition]
The radiation-sensitive resin composition according to the present invention comprises (A) 100 parts by weight of an alkali-soluble copolymer obtained by the following components (a), (b) and (c); (B) 5 to 100 parts by weight of a 1,2-quinonediazide compound and (C) at least 0.1 parts by weight of a water-repellent siloxane resin: